Upturn unsubscribed user
$1.14/ day, billed weekly
Cancel anytime
(Ad-Free, Unlimited access)​
NO CREDIT CARD REQUIRED
KLIC logo KLIC
Upturn stock rating
KLIC logo

Kulicke and Soffa Industries Inc (KLIC)

Upturn stock rating
$40.06
Last Close (24-hour delay)
Profit since last BUY6.88%
upturn advisory
Consider higher Upturn Star rating
BUY since 38 days
  • BUY Advisory
  • SELL Advisory (Profit)​
  • SELL Advisory (Loss)​
  • Profit
  • Loss
  • Pass (Skip investing)
Upturn Stock info Stock price based on last close
*as per simulation
(see disclosures)
Time period over
  • ALL
  • YEAR
  • MONTH
  • WEEK

Upturn Advisory Summary

10/15/2025: KLIC (1-star) has a low Upturn Star Rating. Not recommended to BUY.

Upturn Star Rating

rating

Not Recommended Performance

These Stocks/ETFs, based on Upturn Advisory, consistently fall short of market performance, signaling caution before investing.

Number of Analysts

rating

5 Analysts rated it

Limited analyst coverage, niche firm, research info may be scarce.

1 Year Target Price $41.6

1 Year Target Price $41.6

Analysts Price Target For last 52 week
$41.6 Target price
52w Low $26.34
Current$40.06
52w High $51.01

Analysis of Past Performance

Type Stock
Historic Profit -2.01%
Avg. Invested days 41
Today’s Advisory Consider higher Upturn Star rating
Upturn Star Rating upturn star rating icon
Upturn Advisory Performance Upturn Advisory Performance 2.0
Stock Returns Performance Upturn Returns Performance 1.0
Upturn Profits based on simulation Profits based on simulation
Upturn Profits based on simulation Last Close 10/15/2025

Key Highlights

Company Size Mid-Cap Stock
Market Capitalization 2.03B USD
Price to earnings Ratio 431.78
1Y Target Price 41.6
Price to earnings Ratio 431.78
1Y Target Price 41.6
Volume (30-day avg) 5
Beta 1.58
52 Weeks Range 26.34 - 51.01
Updated Date 10/17/2025
52 Weeks Range 26.34 - 51.01
Updated Date 10/17/2025
Dividends yield (FY) 2.05%
Basic EPS (TTM) 0.09

Analyzing Revenue: Products, Geography and Growth

Revenue by Products

Product revenue - Year on Year

Revenue by Geography

Geography revenue - Year on Year

Earnings Date

Report Date -
When -
Estimate -
Actual -

Profitability

Profit Margin 0.9%
Operating Margin (TTM) -1.9%

Management Effectiveness

Return on Assets (TTM) 4.08%
Return on Equity (TTM) 0.66%

Valuation

Trailing PE 431.78
Forward PE 38.02
Enterprise Value 1624092029
Price to Sales(TTM) 3.08
Enterprise Value 1624092029
Price to Sales(TTM) 3.08
Enterprise Value to Revenue 2.47
Enterprise Value to EBITDA 37.98
Shares Outstanding 52145526
Shares Floating 50219792
Shares Outstanding 52145526
Shares Floating 50219792
Percent Insiders 3.69
Percent Institutions 99.58

ai summary icon Upturn AI SWOT

Kulicke and Soffa Industries Inc

stock logo

Company Overview

overview logo History and Background

Kulicke & Soffa Industries, Inc. was founded in 1951. It is a leading provider of capital equipment and services used to manufacture semiconductors and electronic assemblies. K&S has evolved from a wire bonding company to a diversified supplier of advanced packaging solutions.

business area logo Core Business Areas

  • Advanced Packaging: Offers solutions for advanced packaging applications like flip chip, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP).
  • Wire Bonding: Provides a range of wire bonding equipment for interconnecting semiconductor devices to their packages.
  • Die Bonding: Offers equipment for die attach processes, placing semiconductor dies onto substrates or packages.
  • Aftermarket Products and Services: Provides spare parts, upgrades, and services for its installed base of equipment.

leadership logo Leadership and Structure

The company is led by a CEO and a management team, with a board of directors overseeing corporate governance.

Top Products and Market Share

overview logo Key Offerings

  • Wire Bonders: Kulicke & Soffa is a leading provider of wire bonders. The industry is relatively concentrated, with K&S having a significant, though not dominant, market share. Competitors include ASM Pacific Technology (ASMPT).
  • Advanced Packaging Equipment: Equipment for advanced packaging processes like flip chip and fan-out wafer-level packaging. The market for advanced packaging equipment is growing, presenting an opportunity for K&S. Competitors include ASMPT, Besi, and Tokyo Electron.
  • Die Bonders: K&S provides solutions for the die bonding process. Competitors include ASM Pacific Technology (ASMPT).

Market Dynamics

industry overview logo Industry Overview

The semiconductor equipment industry is cyclical and driven by demand for semiconductors in various end markets, including electronics, automotive, and industrial applications. The industry is also influenced by technological advancements in semiconductor manufacturing.

Positioning

Kulicke & Soffa is a well-established player in the semiconductor equipment industry, with a strong position in wire bonding and a growing presence in advanced packaging. The company's competitive advantages include its technology, customer relationships, and global service network.

Total Addressable Market (TAM)

The semiconductor equipment TAM is estimated to be in the tens of billions of dollars annually. Kulicke & Soffa is positioned to capture a portion of this TAM through its diverse product portfolio and expanding capabilities in advanced packaging.

Upturn SWOT Analysis

Strengths

  • Strong brand recognition
  • Leading position in wire bonding
  • Growing presence in advanced packaging
  • Global service network
  • Strong customer relationships

Weaknesses

  • Cyclical business
  • Dependence on semiconductor industry trends
  • Exposure to currency fluctuations
  • Reliance on a limited number of key customers

Opportunities

  • Growth in advanced packaging market
  • Expansion into new geographic markets
  • Development of new technologies
  • Acquisitions of complementary businesses
  • Increased demand for automotive semiconductors

Threats

  • Economic downturns
  • Increased competition
  • Technological obsolescence
  • Geopolitical risks
  • Supply chain disruptions

Competitors and Market Share

competitor logo Key Competitors

  • ASMPT.SI
  • BESI.AS
  • TEL

Competitive Landscape

Kulicke & Soffa faces competition from other equipment manufacturers, particularly in advanced packaging and wire bonding. Key competitive factors include technology, price, and service.

Major Acquisitions

Palomar Technologies

  • Year: 2024
  • Acquisition Price (USD millions): 407
  • Strategic Rationale: Expands advanced packaging capabilities and customer base.

Growth Trajectory and Initiatives

Historical Growth: Historical growth data unavailable.

Future Projections: Future projection data unavailable.

Recent Initiatives: Recent initiatives data unavailable.

Summary

Kulicke & Soffa is a major player in the semiconductor equipment industry. It has a strong market position but is subject to cyclical trends and competition. Recent acquisitions aim to bolster its advanced packaging capabilities. The company must manage risks like economic downturns and technological shifts to maintain its position.

Peer Comparison

Sources and Disclaimers

Data Sources:

  • Company Website
  • Analyst Reports
  • Industry Publications

Disclaimers:

This analysis is based on publicly available information and should not be considered investment advice.

Upturn AI Summarization AI Summarization is directionally correct and might not be accurate.

Upturn AI Summarization Summarized information shown could be a few years old and not current.

Upturn AI Summarization Fundamental Rating based on AI could be based on old data.

Upturn AI Summarization AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.

About Kulicke and Soffa Industries Inc

Exchange NASDAQ
Headquaters Fort Washington, PA, United States
IPO Launch date 1990-03-26
President, CEO & Director Dr. Fusen Ernie Chen Ph.D.
Sector Technology
Industry Semiconductor Equipment & Materials
Full time employees 2681
Full time employees 2681

Kulicke and Soffa Industries, Inc. engages in the design, manufacture, and sale of capital equipment and tools used to assemble semiconductor devices. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares and services for equipment. It also services, maintains, repairs, and upgrades equipment. The company serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Fort Washington, Pennsylvania.