KLIC official logo KLIC
KLIC 1-star rating from Upturn Advisory
Kulicke and Soffa Industries Inc (KLIC) company logo

Kulicke and Soffa Industries Inc (KLIC)

Kulicke and Soffa Industries Inc (KLIC) 1-star rating from Upturn Advisory
$48.49
Last Close (24-hour delay)
Profit since last BUY7.49%
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Upturn Advisory Summary

12/05/2025: KLIC (1-star) has a low Upturn Star Rating. Not recommended to BUY.

Upturn Star Rating

Upturn 1 star rating for performance

Not Recommended Performance

These Stocks/ETFs, based on Upturn Advisory, consistently fall short of market performance, signaling caution before investing.

Number of Analysts

2 star rating from financial analysts

5 Analysts rated it

Limited analyst coverage, niche firm, research info may be scarce.

1 Year Target Price $46

1 Year Target Price $46

Analysts Price Target For last 52 week
$46 Target price
52w Low $26.34
Current$48.49
52w High $51.01

Analysis of Past Performance

Type Stock
Historic Profit 3.86%
Avg. Invested days 38
Today’s Advisory Consider higher Upturn Star rating
Upturn Star Rating upturn star rating icon
Upturn Advisory Performance Upturn Advisory Performance icon 3.0
Stock Returns Performance Upturn Returns Performance icon 1.0
Upturn Profits based on simulation icon Profits based on simulation
Upturn last close icon Last Close 12/05/2025

Key Highlights

Company Size Mid-Cap Stock
Market Capitalization 2.54B USD
Price to earnings Ratio -
1Y Target Price 46
Price to earnings Ratio -
1Y Target Price 46
Volume (30-day avg) 5
Beta 1.64
52 Weeks Range 26.34 - 51.01
Updated Date 12/6/2025
52 Weeks Range 26.34 - 51.01
Updated Date 12/6/2025
Dividends yield (FY) 1.72%
Basic EPS (TTM) -

Analyzing Revenue: Products, Geography and Growth

Revenue by Products

Product revenue - Year on Year

Revenue by Geography

Geography revenue - Year on Year

Earnings Date

Report Date 2025-11-12
When After Market
Estimate 0.22
Actual 0.28

Profitability

Profit Margin 0.03%
Operating Margin (TTM) -0.81%

Management Effectiveness

Return on Assets (TTM) 0.44%
Return on Equity (TTM) 0.02%

Valuation

Trailing PE -
Forward PE 33.56
Enterprise Value 1988903000
Price to Sales(TTM) 3.88
Enterprise Value 1988903000
Price to Sales(TTM) 3.88
Enterprise Value to Revenue 3.04
Enterprise Value to EBITDA 51.55
Shares Outstanding 52363000
Shares Floating 50422951
Shares Outstanding 52363000
Shares Floating 50422951
Percent Insiders 3.69
Percent Institutions 90.18

Icon representing Upturn AI-generated SWOT analysis summary Upturn AI SWOT

Kulicke and Soffa Industries Inc

Kulicke and Soffa Industries Inc(KLIC) company logo displayed in Upturn AI summary

Company Overview

Company history and background logo History and Background

Founded in 1951, Kulicke and Soffa Industries, Inc. (K&S) initially focused on the development of equipment for the semiconductor industry. Over time, it has evolved into a leading provider of capital equipment and services used in the assembly, packaging, and testing of semiconductor devices.

Company business area logo Core Business Areas

  • Advanced Packaging: Provides solutions for advanced packaging technologies, including flip chip, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP).
  • Wire Bonding: Offers a range of wire bonding equipment used for interconnecting semiconductor devices to their packages.
  • Die Bonding: Provides die bonding equipment for various applications including advanced packaging.
  • Aftermarket Products and Services: Delivers spare parts, tooling, software upgrades, and service contracts to support installed equipment.

leadership logo Leadership and Structure

The leadership team is headed by the CEO, Fusen Chen. The organizational structure is based on functional departments and business units focused on specific product lines and market segments.

Top Products and Market Share

Product Key Offerings logo Key Offerings

  • Wire Bonders: K&S is a leading supplier of wire bonding equipment used in the semiconductor assembly process. Competitors include ASM Pacific Technology (ASMPT) and Shinkawa. Market share is estimated to be around 35-40%.
  • Advanced Packaging Solutions: K&S offers equipment for advanced packaging technologies, including flip chip and fan-out wafer-level packaging (FOWLP). Competitors include ASMPT, Besi, and Tokyo Electron (TEL).
  • Die Bonders: Die bonding equipment for various applications including advanced packaging. Market share is difficult to ascertain, but likely smaller than wire bonding. Besi and ASMPT are major competitors.

Market Dynamics

industry overview logo Industry Overview

The semiconductor equipment industry is cyclical and driven by demand for electronics, advancements in semiconductor technology, and global economic conditions. The industry is consolidating, with larger players acquiring smaller companies.

Positioning

K&S is a leading player in wire bonding and advanced packaging equipment. It has a strong brand reputation and a global customer base. Competitive advantages include technological innovation, product reliability, and customer service.

Total Addressable Market (TAM)

The total addressable market for semiconductor assembly and packaging equipment is estimated to be in the billions of dollars annually. K&S is well-positioned to capture a significant share of this market due to its strong product portfolio and established customer relationships.

Upturn SWOT Analysis

Strengths

  • Strong market position in wire bonding
  • Growing presence in advanced packaging
  • Global customer base
  • Technological innovation
  • Established brand reputation

Weaknesses

  • Cyclical business
  • Dependence on semiconductor industry conditions
  • Smaller scale than some competitors like ASMPT
  • High R&D expenses

Opportunities

  • Growth in advanced packaging technologies
  • Increasing demand for semiconductors in emerging markets
  • Strategic acquisitions
  • Expansion into new product lines

Threats

  • Economic downturns
  • Intense competition
  • Technological obsolescence
  • Geopolitical risks

Competitors and Market Share

Key competitor logo Key Competitors

  • ASMPT (0522.HK)
  • Besi (BESI.AS)
  • Shinkawa (6483.T)

Competitive Landscape

K&S competes primarily on technology, reliability, and customer service. ASMPT is a larger competitor with a broader product portfolio. Besi is strong in die bonding and advanced packaging.

Major Acquisitions

Assembleon

  • Year: 2014
  • Acquisition Price (USD millions): 97.7
  • Strategic Rationale: Expanded K&S's product portfolio into advanced packaging solutions.

Growth Trajectory and Initiatives

Historical Growth: Historical growth has been tied to the semiconductor cycle. Growth in advanced packaging offers potential for above-average growth in certain periods.

Future Projections: Future growth projections vary depending on analyst estimates and semiconductor market forecasts.

Recent Initiatives: Recent initiatives include investments in advanced packaging equipment and strategic partnerships to expand market reach.

Summary

Kulicke and Soffa is a leading player in the semiconductor assembly equipment market, particularly in wire bonding and increasingly in advanced packaging. Its strengths include its strong market position, global presence, and technological expertise. The company faces cyclicality in the semiconductor industry and intense competition, but opportunities exist in the growing advanced packaging market. The company needs to watch out for emerging technologies and intense competition.

Similar Stocks

Sources and Disclaimers

Data Sources:

  • Company Filings (SEC)
  • Industry Reports
  • Analyst Estimates

Disclaimers:

The data and analysis provided are for informational purposes only and should not be considered investment advice. Actual results may vary.

Information icon for Upturn AI Summarization accuracy disclaimer AI Summarization is directionally correct and might not be accurate.

Information icon for Upturn AI Summarization data freshness disclaimer Summarized information shown could be a few years old and not current.

Information icon warning about Upturn AI Fundamental Rating based on potentially old data Fundamental Rating based on AI could be based on old data.

Information icon warning about potential inaccuracies or hallucinations in Upturn AI-generated summaries AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.

About Kulicke and Soffa Industries Inc

Exchange NASDAQ
Headquaters -
IPO Launch date 1990-03-26
Interim CEO, Executive VP of Finance & IT and CFO Mr. Lester A. Wong J.D.
Sector Technology
Industry Semiconductor Equipment & Materials
Full time employees 2551
Full time employees 2551

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and consumables in China, the United States, Taiwan, Malaysia, Japan, the Philippines, Korea, Hong Kong, and internationally. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company provides services used to assemble semiconductor devices, such as integrated circuits, power discretes, light-emitting diode (LEDs), and sensors. It also offers ball bonding equipment, wafer level bonding equipment, and wedge and wedge-related bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares, and services for equipment. In addition, the company services, maintains, repairs, and upgrades equipment; and sells consumable aftermarket solutions and services. It serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Singapore.