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Kulicke and Soffa Industries Inc (KLIC)



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Upturn Advisory Summary
08/14/2025: KLIC (1-star) is currently NOT-A-BUY. Pass it for now.
1 Year Target Price $40.6
1 Year Target Price $40.6
2 | Strong Buy |
1 | Buy |
2 | Hold |
0 | Sell |
0 | Strong Sell |
Analysis of Past Performance
Type Stock | Historic Profit -8.33% | Avg. Invested days 42 | Today’s Advisory PASS |
Upturn Star Rating ![]() ![]() | Upturn Advisory Performance ![]() | Stock Returns Performance ![]() |
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Key Highlights
Company Size Small-Cap Stock | Market Capitalization 1.88B USD | Price to earnings Ratio 401.22 | 1Y Target Price 40.6 |
Price to earnings Ratio 401.22 | 1Y Target Price 40.6 | ||
Volume (30-day avg) 5 | Beta 1.52 | 52 Weeks Range 26.47 - 51.26 | Updated Date 08/15/2025 |
52 Weeks Range 26.47 - 51.26 | Updated Date 08/15/2025 | ||
Dividends yield (FY) 2.18% | Basic EPS (TTM) 0.09 |
Analyzing Revenue: Products, Geography and Growth
Revenue by Products
Product revenue - Year on Year
Revenue by Geography
Geography revenue - Year on Year
Earnings Date
Report Date 2025-08-06 | When - | Estimate 0.05 | Actual 0.07 |
Profitability
Profit Margin 0.9% | Operating Margin (TTM) -1.9% |
Management Effectiveness
Return on Assets (TTM) 4.08% | Return on Equity (TTM) 0.66% |
Valuation
Trailing PE 401.22 | Forward PE 34.6 | Enterprise Value 1430110672 | Price to Sales(TTM) 2.86 |
Enterprise Value 1430110672 | Price to Sales(TTM) 2.86 | ||
Enterprise Value to Revenue 2.17 | Enterprise Value to EBITDA 33.44 | Shares Outstanding 52145500 | Shares Floating 50278195 |
Shares Outstanding 52145500 | Shares Floating 50278195 | ||
Percent Insiders 3.51 | Percent Institutions 95.25 |
Upturn AI SWOT
Kulicke and Soffa Industries Inc

Company Overview
History and Background
Founded in 1951, Kulicke & Soffa (K&S) has evolved from a manufacturer of manual bonders to a global leader in the design and manufacture of semiconductor and electronic assembly equipment. Significant milestones include developing automated bonding technologies and expanding into advanced packaging solutions.
Core Business Areas
- Advanced Packaging: Supplies equipment for advanced packaging technologies, including flip chip, fan-out wafer level packaging (FOWLP), and hybrid bonding. Key technologies include thermo-compression bonding and laser-assisted bonding.
- Ball Bonding: Offers a range of ball bonders used in wire bonding, a fundamental process for connecting semiconductor chips to external circuits. Serves automotive, industrial and general electronics markets.
- Advanced Surface Mount Technology (SMT) Solutions: Equipment for placing components on PCBs.
- Aftermarket Products and Services: Provides spare parts, upgrades, and services for K&S equipment.
Leadership and Structure
The leadership team includes the CEO and key executives in finance, operations, and technology. The organizational structure is based on functional departments and product lines, with a global sales and service network.
Top Products and Market Share
Key Offerings
- Ball Bonders: Wire bonding equipment accounts for a significant portion of K&S's revenue. Market share estimated at approximately 50% in the total wire bonding market in 2023. Competitors include ASM Pacific Technology and Hanmi Semiconductor. Wire bonding sales accounted for $391.4 million in net revenue for fiscal year 2023.
- Advanced Packaging Equipment: Machines used for flip chip, fan-out wafer level packaging (FOWLP), and hybrid bonding, critical for high-performance computing and mobile devices. Market share varies by segment, with increasing presence in advanced packaging. Competitors include Besi, ASMPT and Tokyo Seimitsu.
- LUMINEX Laser Processing System: A laser-based solution used in advanced packaging applications. Competitors include Coherent and Lumentum.
Market Dynamics
Industry Overview
The semiconductor and electronic assembly equipment industry is highly cyclical, driven by global demand for electronics, technological advancements (e.g., 5G, AI), and capital expenditures by semiconductor manufacturers.
Positioning
Kulicke & Soffa is positioned as a technology leader in advanced packaging and wire bonding solutions. Competitive advantages include its established market presence, technological expertise, and comprehensive product portfolio.
Total Addressable Market (TAM)
The overall semiconductor equipment market is estimated to be several hundred billion dollars. K&S targets specific segments within this market, focusing on advanced packaging and wire bonding, positioning it to capture a significant share of the TAM.
Upturn SWOT Analysis
Strengths
- Strong market share in wire bonding
- Established customer base
- Technological expertise in advanced packaging
- Global sales and service network
- Diverse product portfolio
Weaknesses
- Cyclical revenue stream
- Dependence on capital expenditures by semiconductor manufacturers
- Competition from larger, more diversified companies
Opportunities
- Growth in advanced packaging market
- Expansion into new geographic regions
- Development of innovative technologies
- Increasing demand for automotive electronics
Threats
- Economic downturns
- Technological obsolescence
- Intense competition
- Geopolitical risks
Competitors and Market Share
Key Competitors
- ASMPT (0522.HK)
- Besi (BESI.AS)
- Hanmi Semiconductor (042700.KS)
Competitive Landscape
K&S competes with larger, more diversified companies. Its advantages include its established market presence and technological expertise. Disadvantages include its smaller size and limited product diversification.
Major Acquisitions
Advanced Yield Management (AYM)
- Year: 2020
- Acquisition Price (USD millions): 95
- Strategic Rationale: Expand inspection capabilities for advanced packaging applications.
Growth Trajectory and Initiatives
Historical Growth: K&S's growth has been cyclical, with periods of rapid expansion followed by periods of contraction. Long-term growth has been driven by technological advancements and increasing demand for electronics.
Future Projections: Analysts project moderate revenue growth in the coming years, driven by the growth of the advanced packaging market. Profitability is expected to improve as volumes increase.
Recent Initiatives: Recent initiatives include expanding its presence in the advanced packaging market, developing new technologies, and improving operational efficiency.
Summary
Kulicke & Soffa is a relatively strong company with a leading position in wire bonding and increasing presence in advanced packaging. Its cyclical revenue stream and dependence on capital expenditures by semiconductor manufacturers present challenges. The company's technological expertise and established customer base are key strengths, while it needs to navigate intense competition and geopolitical risks.
Peer Comparison
Sources and Disclaimers
Data Sources:
- Kulicke & Soffa's Annual Reports
- Sec Filings
- Analyst Reports
- Industry Research Reports
Disclaimers:
The information provided is for informational purposes only and should not be considered investment advice. Market share data is based on estimates and may not be precise. Financial data is based on past performance and is not indicative of future results.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About Kulicke and Soffa Industries Inc
Exchange NASDAQ | Headquaters Fort Washington, PA, United States | ||
IPO Launch date 1990-03-26 | President, CEO & Director Dr. Fusen Ernie Chen Ph.D. | ||
Sector Technology | Industry Semiconductor Equipment & Materials | Full time employees 2681 | Website https://www.kns.com |
Full time employees 2681 | Website https://www.kns.com |
Kulicke and Soffa Industries, Inc. engages in the design, manufacture, and sale of capital equipment and tools used to assemble semiconductor devices. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares and services for equipment. It also services, maintains, repairs, and upgrades equipment. The company serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Fort Washington, Pennsylvania.

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