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KLIC 
Kulicke and Soffa Industries Inc (KLIC)
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Upturn Advisory Summary
12/05/2025: KLIC (1-star) has a low Upturn Star Rating. Not recommended to BUY.
Upturn Star Rating
Not Recommended Performance
These Stocks/ETFs, based on Upturn Advisory, consistently fall short of market performance, signaling caution before investing.
Number of Analysts
5 Analysts rated it
Limited analyst coverage, niche firm, research info may be scarce.
1 Year Target Price $46
1 Year Target Price $46
| 2 | Strong Buy |
| 1 | Buy |
| 2 | Hold |
| 0 | Sell |
| 0 | Strong Sell |
Analysis of Past Performance
Type Stock | Historic Profit 3.86% | Avg. Invested days 38 | Today’s Advisory Consider higher Upturn Star rating |
Upturn Star Rating | Upturn Advisory Performance  3.0 | Stock Returns Performance  1.0 |
| Profits based on simulation | Last Close 12/05/2025 |
Key Highlights
Company Size Mid-Cap Stock | Market Capitalization 2.54B USD | Price to earnings Ratio - | 1Y Target Price 46 |
Price to earnings Ratio - | 1Y Target Price 46 | ||
Volume (30-day avg) 5 | Beta 1.64 | 52 Weeks Range 26.34 - 51.01 | Updated Date 12/6/2025 |
52 Weeks Range 26.34 - 51.01 | Updated Date 12/6/2025 | ||
Dividends yield (FY) 1.72% | Basic EPS (TTM) - |
Analyzing Revenue: Products, Geography and Growth
Revenue by Products
Product revenue - Year on Year
Revenue by Geography
Geography revenue - Year on Year
Earnings Date
Report Date 2025-11-12 | When After Market | Estimate 0.22 | Actual 0.28 |
Profitability
Profit Margin 0.03% | Operating Margin (TTM) -0.81% |
Management Effectiveness
Return on Assets (TTM) 0.44% | Return on Equity (TTM) 0.02% |
Valuation
Trailing PE - | Forward PE 33.56 | Enterprise Value 1988903000 | Price to Sales(TTM) 3.88 |
Enterprise Value 1988903000 | Price to Sales(TTM) 3.88 | ||
Enterprise Value to Revenue 3.04 | Enterprise Value to EBITDA 51.55 | Shares Outstanding 52363000 | Shares Floating 50422951 |
Shares Outstanding 52363000 | Shares Floating 50422951 | ||
Percent Insiders 3.69 | Percent Institutions 90.18 |
Upturn AI SWOT
Kulicke and Soffa Industries Inc
Company Overview
History and Background
Founded in 1951, Kulicke and Soffa Industries, Inc. (K&S) initially focused on the development of equipment for the semiconductor industry. Over time, it has evolved into a leading provider of capital equipment and services used in the assembly, packaging, and testing of semiconductor devices.
Core Business Areas
- Advanced Packaging: Provides solutions for advanced packaging technologies, including flip chip, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP).
- Wire Bonding: Offers a range of wire bonding equipment used for interconnecting semiconductor devices to their packages.
- Die Bonding: Provides die bonding equipment for various applications including advanced packaging.
- Aftermarket Products and Services: Delivers spare parts, tooling, software upgrades, and service contracts to support installed equipment.
Leadership and Structure
The leadership team is headed by the CEO, Fusen Chen. The organizational structure is based on functional departments and business units focused on specific product lines and market segments.
Top Products and Market Share
Key Offerings
- Wire Bonders: K&S is a leading supplier of wire bonding equipment used in the semiconductor assembly process. Competitors include ASM Pacific Technology (ASMPT) and Shinkawa. Market share is estimated to be around 35-40%.
- Advanced Packaging Solutions: K&S offers equipment for advanced packaging technologies, including flip chip and fan-out wafer-level packaging (FOWLP). Competitors include ASMPT, Besi, and Tokyo Electron (TEL).
- Die Bonders: Die bonding equipment for various applications including advanced packaging. Market share is difficult to ascertain, but likely smaller than wire bonding. Besi and ASMPT are major competitors.
Market Dynamics
Industry Overview
The semiconductor equipment industry is cyclical and driven by demand for electronics, advancements in semiconductor technology, and global economic conditions. The industry is consolidating, with larger players acquiring smaller companies.
Positioning
K&S is a leading player in wire bonding and advanced packaging equipment. It has a strong brand reputation and a global customer base. Competitive advantages include technological innovation, product reliability, and customer service.
Total Addressable Market (TAM)
The total addressable market for semiconductor assembly and packaging equipment is estimated to be in the billions of dollars annually. K&S is well-positioned to capture a significant share of this market due to its strong product portfolio and established customer relationships.
Upturn SWOT Analysis
Strengths
- Strong market position in wire bonding
- Growing presence in advanced packaging
- Global customer base
- Technological innovation
- Established brand reputation
Weaknesses
- Cyclical business
- Dependence on semiconductor industry conditions
- Smaller scale than some competitors like ASMPT
- High R&D expenses
Opportunities
- Growth in advanced packaging technologies
- Increasing demand for semiconductors in emerging markets
- Strategic acquisitions
- Expansion into new product lines
Threats
- Economic downturns
- Intense competition
- Technological obsolescence
- Geopolitical risks
Competitors and Market Share
Key Competitors
- ASMPT (0522.HK)
- Besi (BESI.AS)
- Shinkawa (6483.T)
Competitive Landscape
K&S competes primarily on technology, reliability, and customer service. ASMPT is a larger competitor with a broader product portfolio. Besi is strong in die bonding and advanced packaging.
Major Acquisitions
Assembleon
- Year: 2014
- Acquisition Price (USD millions): 97.7
- Strategic Rationale: Expanded K&S's product portfolio into advanced packaging solutions.
Growth Trajectory and Initiatives
Historical Growth: Historical growth has been tied to the semiconductor cycle. Growth in advanced packaging offers potential for above-average growth in certain periods.
Future Projections: Future growth projections vary depending on analyst estimates and semiconductor market forecasts.
Recent Initiatives: Recent initiatives include investments in advanced packaging equipment and strategic partnerships to expand market reach.
Summary
Kulicke and Soffa is a leading player in the semiconductor assembly equipment market, particularly in wire bonding and increasingly in advanced packaging. Its strengths include its strong market position, global presence, and technological expertise. The company faces cyclicality in the semiconductor industry and intense competition, but opportunities exist in the growing advanced packaging market. The company needs to watch out for emerging technologies and intense competition.
Similar Stocks
Sources and Disclaimers
Data Sources:
- Company Filings (SEC)
- Industry Reports
- Analyst Estimates
Disclaimers:
The data and analysis provided are for informational purposes only and should not be considered investment advice. Actual results may vary.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About Kulicke and Soffa Industries Inc
Exchange NASDAQ | Headquaters - | ||
IPO Launch date 1990-03-26 | Interim CEO, Executive VP of Finance & IT and CFO Mr. Lester A. Wong J.D. | ||
Sector Technology | Industry Semiconductor Equipment & Materials | Full time employees 2551 | Website https://www.kns.com |
Full time employees 2551 | Website https://www.kns.com | ||
Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and consumables in China, the United States, Taiwan, Malaysia, Japan, the Philippines, Korea, Hong Kong, and internationally. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company provides services used to assemble semiconductor devices, such as integrated circuits, power discretes, light-emitting diode (LEDs), and sensors. It also offers ball bonding equipment, wafer level bonding equipment, and wedge and wedge-related bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares, and services for equipment. In addition, the company services, maintains, repairs, and upgrades equipment; and sells consumable aftermarket solutions and services. It serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Singapore.
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