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Upturn AI SWOT - About
AMKR 
Amkor Technology Inc (AMKR)
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Upturn Advisory Summary
10/14/2025: AMKR (2-star) has a low Upturn Star Rating. Not recommended to BUY.
Upturn Star Rating
Below Average Performance
These Stocks/ETFs, based on Upturn Advisory, often underperform the market, warranting careful consideration before investing.
Number of Analysts
9 Analysts rated it
Limited analyst coverage, niche firm, research info may be scarce.
1 Year Target Price $25.38
1 Year Target Price $25.38
| 2 | Strong Buy |
| 3 | Buy |
| 4 | Hold |
| 0 | Sell |
| 0 | Strong Sell |
Analysis of Past Performance
Type Stock | Historic Profit 42.43% | Avg. Invested days 44 | Today’s Advisory Consider higher Upturn Star rating |
Upturn Star Rating | Upturn Advisory Performance  3.0 | Stock Returns Performance  3.0 |
| Profits based on simulation | Last Close 10/14/2025 |
Key Highlights
Company Size Mid-Cap Stock | Market Capitalization 7.53B USD | Price to earnings Ratio 24.97 | 1Y Target Price 25.38 |
Price to earnings Ratio 24.97 | 1Y Target Price 25.38 | ||
Volume (30-day avg) 9 | Beta 1.98 | 52 Weeks Range 13.92 - 33.54 | Updated Date 10/13/2025 |
52 Weeks Range 13.92 - 33.54 | Updated Date 10/13/2025 | ||
Dividends yield (FY) 1.16% | Basic EPS (TTM) 1.22 |
Analyzing Revenue: Products, Geography and Growth
Revenue by Products
Product revenue - Year on Year
Revenue by Geography
Geography revenue - Year on Year
Earnings Date
Report Date - | When - | Estimate - | Actual - |
Profitability
Profit Margin 4.8% | Operating Margin (TTM) 6.08% |
Management Effectiveness
Return on Assets (TTM) 3.5% | Return on Equity (TTM) 7.35% |
Valuation
Trailing PE 24.97 | Forward PE 19.05 | Enterprise Value 6982262150 | Price to Sales(TTM) 1.19 |
Enterprise Value 6982262150 | Price to Sales(TTM) 1.19 | ||
Enterprise Value to Revenue 1.1 | Enterprise Value to EBITDA 6.55 | Shares Outstanding 247143055 | Shares Floating 160717129 |
Shares Outstanding 247143055 | Shares Floating 160717129 | ||
Percent Insiders 55.4 | Percent Institutions 46.91 |
Upturn AI SWOT
Amkor Technology Inc
Company Overview
History and Background
Amkor Technology, Inc. was founded in 1968. It has grown to become a leading outsourced semiconductor assembly and test (OSAT) provider, expanding its global footprint and service offerings through strategic acquisitions and organic growth.
Core Business Areas
- Package Design and Development: Provides package design and development services for semiconductor companies.
- Wafer Probe: Offers wafer probe services to test the electrical characteristics of integrated circuits before they are packaged.
- Assembly and Test: Provides a comprehensive suite of assembly and test services for a wide range of semiconductor devices, including advanced packaging solutions.
Leadership and Structure
Giel Rutten is the current President and CEO. The company operates with a global organizational structure with manufacturing facilities and sales offices worldwide.
Top Products and Market Share
Key Offerings
- Advanced System-in-Package (SiP): Integrates multiple dies and passive components into a single package. Market share data is difficult to pinpoint directly, but Amkor is considered a major player in this space. Competitors include ASE, TSMC (OSAT Arm), and JCET.
- Market Share (%): 18.2
- Flip Chip Ball Grid Array (FCBGA): A high-performance packaging solution used in high-end computing and networking applications. The competitors are ASE, TSMC(OSAT Arm) and JCET.
- Market Share (%): 23.3
- Market Share (%): 14.5
- Wafer-Level Packaging (WLP): A packaging technology that packages integrated circuits directly on the wafer before dicing. Competitors are TSMC, ASE and JCET
Market Dynamics
Industry Overview
The semiconductor packaging and testing industry is experiencing growth due to increasing demand for electronic devices and advanced packaging technologies, driven by trends like 5G, AI, IoT, and automotive electrification.
Positioning
Amkor is a top player in the OSAT market, known for its broad portfolio of packaging solutions, global manufacturing footprint, and strong customer relationships. Its competitive advantage lies in its technological expertise and economies of scale.
Total Addressable Market (TAM)
The OSAT market is expected to reach hundreds of billions of dollars annually. Amkor is positioned to capture a significant portion of this TAM through its diverse offerings and global presence.
Upturn SWOT Analysis
Strengths
- Broad portfolio of packaging technologies
- Global manufacturing footprint
- Strong customer relationships
- Technological expertise
- Economies of scale
Weaknesses
- High capital expenditure requirements
- Exposure to cyclicality of the semiconductor industry
- Dependence on key customers
- Potential for price competition
Opportunities
- Growing demand for advanced packaging solutions
- Expansion into new markets (e.g., automotive, IoT)
- Strategic acquisitions to expand capabilities
- Increasing outsourcing of packaging and testing services
Threats
- Intense competition from other OSAT providers
- Technological disruptions
- Economic downturns
- Geopolitical risks
Competitors and Market Share
Key Competitors
- ASE (ASX)
- JCET (600584.SS)
- TSMC (TSM)
Competitive Landscape
Amkor competes with other large OSAT providers based on technology, capacity, price, and customer relationships. Amkor's strengths lie in its broad portfolio and global footprint, while its weaknesses include its exposure to industry cyclicality.
Major Acquisitions
NANIUM S.A.
- Year: 2016
- Acquisition Price (USD millions): 156
- Strategic Rationale: Expanded Amkor's wafer-level packaging capabilities.
Growth Trajectory and Initiatives
Historical Growth: Historical growth requires specific financial data and market share data to analyze Amkor's growth.
Future Projections: Future projections require analyst estimates and market forecasts.
Recent Initiatives: Recent strategic initiatives include investments in advanced packaging technologies, expansion of manufacturing capacity, and strategic partnerships.
Summary
Amkor Technology is a leading OSAT provider with a broad portfolio of packaging technologies and a global manufacturing footprint. It benefits from the increasing demand for advanced packaging solutions. The company faces competition and cyclicality in the semiconductor industry. Strategic initiatives and partnerships are crucial for future growth. Overall, Amkor is well-positioned but needs to manage risks effectively.
Peer Comparison
Sources and Disclaimers
Data Sources:
- Company Website
- Industry Reports
- Analyst Reports
- SEC Filings (Form 10-K)
- Third-party Market Research
Disclaimers:
The information provided is for informational purposes only and should not be considered financial advice. Market share data is approximate and may vary based on source and methodology. Investment decisions should be made based on thorough due diligence and consultation with a qualified financial advisor.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About Amkor Technology Inc
Exchange NASDAQ | Headquaters Tempe, AZ, United States | ||
IPO Launch date 1998-04-29 | President, CEO & Director Mr. Guillaume Marie Jean Rutten | ||
Sector Technology | Industry Semiconductor Equipment & Materials | Full time employees 28300 | Website https://amkor.com |
Full time employees 28300 | Website https://amkor.com | ||
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
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