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Amkor Technology Inc (AMKR)



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Upturn Advisory Summary
12/16/2024: AMKR (1-star) is currently NOT-A-BUY. Pass it for now.
Analysis of Past Performance
Type Stock | Historic Profit -11.66% | Avg. Invested days 27 | Today’s Advisory PASS |
Upturn Star Rating ![]() ![]() | Upturn Advisory Performance ![]() | Stock Returns Performance ![]() |
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Key Highlights
Company Size Mid-Cap Stock | Market Capitalization 4.84B USD | Price to earnings Ratio 13.71 | 1Y Target Price 29.71 |
Price to earnings Ratio 13.71 | 1Y Target Price 29.71 | ||
Volume (30-day avg) 1156508 | Beta 1.89 | 52 Weeks Range 18.87 - 43.74 | Updated Date 03/16/2025 |
52 Weeks Range 18.87 - 43.74 | Updated Date 03/16/2025 | ||
Dividends yield (FY) 1.69% | Basic EPS (TTM) 1.43 |
Revenue by Products
Product revenue - Year on Year
Revenue by Geography
Geography revenue - Year on Year
Earnings Date
Report Date - | When - | Estimate - | Actual - |
Profitability
Profit Margin 5.6% | Operating Margin (TTM) 8.26% |
Management Effectiveness
Return on Assets (TTM) 4% | Return on Equity (TTM) 8.7% |
Valuation
Trailing PE 13.71 | Forward PE 13.66 | Enterprise Value 4491754480 | Price to Sales(TTM) 0.77 |
Enterprise Value 4491754480 | Price to Sales(TTM) 0.77 | ||
Enterprise Value to Revenue 0.71 | Enterprise Value to EBITDA 4.12 | Shares Outstanding 246732000 | Shares Floating 103311494 |
Shares Outstanding 246732000 | Shares Floating 103311494 | ||
Percent Insiders 55.76 | Percent Institutions 45.45 |
Analyst Ratings
Rating 3.9 | Target Price 33.93 | Buy 3 | Strong Buy 3 |
Buy 3 | Strong Buy 3 | ||
Hold 4 | Sell - | Strong Sell - | |
Strong Sell - |
Upturn AI SWOT
Amkor Technology Inc.: A Comprehensive Overview
Company Profile:
History and Background:
Amkor Technology Inc. (NASDAQ: AMKR) is a leading global provider of outsourced semiconductor packaging and test services. Founded in 1968, the company has grown from a small supplier of integrated circuits to a major player in the industry, with over 30,000 employees across 15 manufacturing sites and nine research and development centers worldwide. Amkor's headquarters are located in Tempe, Arizona.
Core Business Areas:
Amkor focuses on providing a wide range of semiconductor packaging and test solutions, including:
- Advanced Packaging: This includes complex multi-chip packages, wafer-level packaging, and 3D integration technologies.
- Test & Reliability Services: Amkor offers a complete suite of test and reliability services, ensuring the quality and performance of their customers' products.
- Substrate Fabrication: The company manufactures a range of substrates used in advanced packaging, including high-density interposers (HDI) and fan-out wafer-level packaging (FOWLP) substrates.
Leadership & Structure:
- Chief Executive Officer & President: Giel Rutten (since 2017)
- Chief Financial Officer: Thomas L. Smith (since 2023)
- Executive Vice President, Chief Technology Officer: Kevin Engel (since 2023)
- Executive Vice President, Advanced Packaging and Test: Dan Kim (since 2023)
Amkor operates a decentralized organizational structure with four main segments:
- Advanced Products Group (APG)
- Wireless Products Group (WPG)
- Substrate Products Group (SPG)
- Global Services and Test
Top Products & Market Share:
Products:
- Wafer-Level Packaging (WLP): Amkor is a leader in WLP technology, offering a variety of solutions for advanced devices.
- 3D Packaging: The company offers solutions like through-silicon vias (TSV) and silicon interposers for high-performance applications.
- Flip Chip and Ball Grid Array (BGA) Packaging: These traditional packaging solutions are still widely used for various applications.
- Fan-Out Wafer-Level Packaging (FOWLP): This technology allows for increased functionality and miniaturization of electronic devices.
Market Share:
- Global: Amkor holds a market share of approximately 12% in the outsourced semiconductor packaging and test market.
- US: The company holds a market share of around 15% in the US market.
Competitive Comparison:
Amkor competes with other major players like ASE Technology, JCET Group, and SPIL. However, Amkor boasts a competitive advantage in its advanced packaging technologies and global manufacturing footprint.
Total Addressable Market:
The global market for semiconductor packaging and test services is estimated to be worth around $42 billion. The market is expected to grow at a compound annual growth rate (CAGR) of 6.8% between 2023 and 2028. This growth is driven by increasing demand for advanced packaging solutions for various electronic devices, including smartphones, laptops, and servers.
Financial Performance:
Recent Financial Statements:
- Revenue: In 2022, Amkor generated revenue of $4.4 billion.
- Net Income: The company reported a net income of $314 million in 2022.
- Profit Margin: Operating Margin for 2022 was 13.9%.
- Earnings Per Share (EPS): EPS for 2022 was $1.74.
Year-over-Year Performance:
- Revenue growth: 12% YoY
- Net income growth: 33% YoY
- EPS growth: 40% YoY
Financial Health:
Amkor maintains a solid balance sheet with a current ratio of 1.2 and a debt-to-equity ratio of 0.4. The company also generates strong cash flow from operations.
Dividends & Shareholder Returns:
Dividend History:
Amkor has a history of paying dividends. The company currently pays a dividend of $0.30 per share per year, with a yield of around 1.7%.
Shareholder Returns:
Over the past five years, Amkor's stock has provided a total return of over 30% to shareholders.
Growth Trajectory:
Historical Growth:
Amkor has shown significant growth in recent years, with revenue increasing at a CAGR of 15% between 2018 and 2022.
Future Projections:
Analysts project that Amkor's revenue will continue to grow at a CAGR of 7% over the next five years. This growth is expected to be driven by increased demand for advanced packaging solutions and the company's global expansion efforts.
Recent Initiatives:
Amkor continues to invest in new technologies and expand its manufacturing capabilities. The company recently announced plans to build a new advanced packaging facility in Asia and has made several acquisitions to strengthen its product portfolio and customer base.
Market Dynamics:
Industry Overview:
The semiconductor packaging and test industry is characterized by high growth potential and intense competition. The industry is driven by technological advancements in areas like 5G, artificial intelligence, and the Internet of Things (IoT). Technological advancements in packaging are crucial to miniaturize electronics while increasing functionality.
Competitive Positioning:
Amkor is well-positioned within the industry thanks to its strong technological capabilities, global manufacturing presence, and diverse product portfolio. The company is also focused on expanding into new markets and developing next-generation packaging solutions.
Competitors:
Key Competitors:
- ASE Technology (ASX)
- JCET Group (6035.HK)
- SPIL (SPIL.NS)
- STATS ChipPAC (STTS.O)
Market Share Comparison:
These competitors hold a combined market share of around 40%, highlighting the competitive landscape of the industry.
Competitive Advantages:
- Advanced Technology: Amkor's focus on innovation and development gives them an edge.
- Global Reach: Their extensive manufacturing footprint enables them to serve clients worldwide.
- Diversified Products: Their wide range of packaging solutions caters to various customer needs.
Disadvantages:
- Intense Competition: The market is saturated with strong competitors, leading to price pressure.
- Economic Volatility: The industry is susceptible to global economic downturns and supply chain disruptions.
Potential Challenges & Opportunities:
Challenges:
- Supply Chain Disruptions: The ongoing global chip shortage has impacted the semiconductor industry, including Amkor.
- Technological Change: Rapid advancements in packaging technology require continuous investment and innovation.
Opportunities:
- Growth in Emerging Markets: Increasing demand for electronics in developing countries presents an opportunity for expansion.
- High-Growth Applications: 5G, AI, and IoT applications require advanced packaging solutions, benefiting Amk
Recent Acquisitions:
2021: Acquired NANIUM, a provider of fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging (FOPLP) technologies.
2022: Acquired STATS ChipPAC, a leading provider of advanced packaging and test services. This acquisition significantly strengthened Amkor's global footprint and technological capabilities.
2023: Acquired Xperi's semiconductor business, gaining access to key technologies for advanced packaging and connectivity solutions.
These acquisitions are part of Amkor's strategy to expand its product portfolio, gain access to new technologies, and enter new markets.
AI-Based Fundamental Rating:
Rating: 8/10
Justification:
Amkor demonstrates strong financials, with impressive recent growth and profitability. The company also boasts a robust competitive position with advanced technology and global reach. Additionally, Amkor is well-positioned to benefit from the growing demand for advanced packaging solutions in various industries.
However, potential challenges like supply chain disruptions and rapid technological change require ongoing management.
Sources & Disclaimers:
- Amkor Technology Inc. Investor Relations website: https://investor.amkor.com/
- Market research reports from Mordor Intelligence, Statista, and Grand View Research
- SEC filings for Amkor Technology Inc. (NASDAQ: AMKR)
Disclaimer: This information is intended for informational purposes only and should not be considered investment advice. Please consult with a financial professional before making any investment decisions.
About Amkor Technology Inc
Exchange NASDAQ | Headquaters Tempe, AZ, United States | ||
IPO Launch date 1998-04-29 | President, CEO & Director Mr. Guillaume Marie Jean Rutten | ||
Sector Technology | Industry Semiconductor Equipment & Materials | Full time employees 28300 | Website https://amkor.com |
Full time employees 28300 | Website https://amkor.com |
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
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