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Upturn AI SWOT - About
Amkor Technology Inc (AMKR)
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Upturn Advisory Summary
04/22/2025: AMKR (1-star) is currently NOT-A-BUY. Pass it for now.
Upturn Star Rating
Not Recommended Performance
These Stocks/ETFs, based on Upturn Advisory, consistently fall short of market performance, signaling caution before investing.
Analysis of Past Performance
Type Stock | Historic Profit -11.69% | Avg. Invested days 27 | Today’s Advisory PASS |
Upturn Star Rating | Upturn Advisory Performance  3.0 | Stock Returns Performance  1.0 |
| Profits based on simulation | Last Close 04/22/2025 |
Key Highlights
Company Size Mid-Cap Stock | Market Capitalization 4.34B USD | Price to earnings Ratio 12.27 | 1Y Target Price 27.49 |
Price to earnings Ratio 12.27 | 1Y Target Price 27.49 | ||
Volume (30-day avg) 3064425 | Beta 1.89 | 52 Weeks Range 14.03 - 43.74 | Updated Date 04/25/2025 |
52 Weeks Range 14.03 - 43.74 | Updated Date 04/25/2025 | ||
Dividends yield (FY) 1.90% | Basic EPS (TTM) 1.43 |
Analyzing Revenue: Products, Geography and Growth
Revenue by Products
Product revenue - Year on Year
Revenue by Geography
Geography revenue - Year on Year
Earnings Date
Report Date 2025-04-28 | When Before Market | Estimate - | Actual - |
Profitability
Profit Margin 5.6% | Operating Margin (TTM) 8.26% |
Management Effectiveness
Return on Assets (TTM) 4% | Return on Equity (TTM) 8.7% |
Valuation
Trailing PE 12.27 | Forward PE 12.12 | Enterprise Value 3949654848 | Price to Sales(TTM) 0.69 |
Enterprise Value 3949654848 | Price to Sales(TTM) 0.69 | ||
Enterprise Value to Revenue 0.63 | Enterprise Value to EBITDA 3.62 | Shares Outstanding 247056000 | Shares Floating 103481739 |
Shares Outstanding 247056000 | Shares Floating 103481739 | ||
Percent Insiders 54.69 | Percent Institutions 45.75 |
Analyst Ratings
Rating 3.9 | Target Price 33.93 | Buy 3 | Strong Buy 3 |
Buy 3 | Strong Buy 3 | ||
Hold 4 | Sell - | Strong Sell - | |
Strong Sell - |
Upturn AI SWOT
Amkor Technology Inc
Company Overview
History and Background
Amkor Technology, Inc. was founded in 1968. It has grown to become one of the world's largest providers of outsourced semiconductor packaging and test services. Significant milestones include expanding its global manufacturing footprint and developing advanced packaging technologies.
Core Business Areas
- Advanced Products: Provides advanced packaging solutions for high-performance applications, including flip chip, wafer-level packaging (WLP), and 2.5D/3D packaging.
- Mainstream Products: Offers a broad range of mainstream packaging solutions for consumer electronics, communications, and automotive applications, including leadframe and laminate-based packages.
- Test Services: Provides comprehensive test services for semiconductors, including wafer probe, final test, and system-level test.
Leadership and Structure
The leadership team includes Giel Rutten (President and CEO). The organizational structure is based on product lines and geographic regions.
Top Products and Market Share
Key Offerings
- Flip Chip Ball Grid Array (FCBGA): Provides high-density packaging for processors and GPUs. Market share varies by application. Competitors include ASE, TSMC, and Samsung.
- Quad Flat No-leads (QFN): A cost-effective packaging solution for a wide range of applications. Market share is significant in consumer electronics. Competitors include ASE, JCET Group, and Powertech Technology.
- Wafer-Level Chip Scale Package (WLCSP): Provides the smallest form factor packaging solution. Used in mobile and wearable devices. Competitors include ASE, TSMC, and STATS ChipPAC.
Market Dynamics
Industry Overview
The semiconductor packaging and test industry is driven by the increasing demand for smaller, faster, and more power-efficient electronic devices. Key trends include advanced packaging, heterogeneous integration, and the growth of AI, IoT, and automotive applications.
Positioning
Amkor Technology is a leading player in the outsourced semiconductor assembly and test (OSAT) market, with a broad portfolio of packaging and test solutions. Its competitive advantages include its global manufacturing footprint, advanced technology capabilities, and strong customer relationships.
Total Addressable Market (TAM)
The OSAT market is expected to reach hundreds of billions USD in the coming years. Amkor Technology is well-positioned to capture a significant share of this market, with a focus on advanced packaging and high-growth applications.
Upturn SWOT Analysis
Strengths
- Global Manufacturing Footprint
- Advanced Packaging Technology
- Strong Customer Relationships
- Broad Product Portfolio
Weaknesses
- High Capital Expenditure
- Exposure to Cyclical Semiconductor Industry
- Dependence on Key Customers
Opportunities
- Growth of Advanced Packaging
- Expansion into New Markets
- Increasing Outsourcing Trend
- AI and IoT growth
Threats
- Intense Competition
- Technological Changes
- Economic Downturns
- Geopolitical Risks
Competitors and Market Share
Key Competitors
- ASE (ASX)
- JCET Group (600584.SS)
- STATS ChipPAC
Competitive Landscape
Amkor Technology competes with other OSAT providers based on technology, cost, and service. Amkor's strengths include its broad portfolio and global footprint, while its weaknesses include high capital expenditure and exposure to cyclical demand.
Major Acquisitions
Growth Trajectory and Initiatives
Historical Growth: Historical growth will vary based on the time and source of data. The structure requires data and data sources change rapidly
Future Projections: Future Projections will vary based on the time and source of data. The structure requires data and data sources change rapidly
Recent Initiatives: Recent Initiatives will vary based on the time and source of data. The structure requires data and data sources change rapidly
Summary
Amkor Technology is a leading OSAT provider with a strong position in the advanced packaging market. Its global footprint and technology capabilities are key strengths. However, it faces risks from intense competition and cyclical demand. Recent initiatives will likely drive future growth. Amkor is a solid player in the semiconductor market.
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Sources and Disclaimers
Data Sources:
- Company Filings
- Market Research Reports
- Analyst Estimates
Disclaimers:
The information provided is for informational purposes only and should not be considered investment advice. Market conditions and company performance can change rapidly.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About Amkor Technology Inc
Exchange NASDAQ | Headquaters Tempe, AZ, United States | ||
IPO Launch date 1998-04-29 | President, CEO & Director Mr. Guillaume Marie Jean Rutten | ||
Sector Technology | Industry Semiconductor Equipment & Materials | Full time employees 28300 | Website https://amkor.com |
Full time employees 28300 | Website https://amkor.com | ||
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
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