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Amkor Technology Inc (AMKR)



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Upturn Advisory Summary
06/30/2025: AMKR (1-star) has a low Upturn Star Rating. Not recommended to BUY.
1 Year Target Price $22.29
1 Year Target Price $22.29
2 | Strong Buy |
3 | Buy |
4 | Hold |
0 | Sell |
0 | Strong Sell |
Analysis of Past Performance
Type Stock | Historic Profit -0.4% | Avg. Invested days 31 | Today’s Advisory Consider higher Upturn Star rating |
Upturn Star Rating ![]() ![]() | Upturn Advisory Performance ![]() | Stock Returns Performance ![]() |
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Key Highlights
Company Size Mid-Cap Stock | Market Capitalization 5.23B USD | Price to earnings Ratio 16.52 | 1Y Target Price 22.29 |
Price to earnings Ratio 16.52 | 1Y Target Price 22.29 | ||
Volume (30-day avg) 9 | Beta 1.83 | 52 Weeks Range 13.97 - 43.55 | Updated Date 06/29/2025 |
52 Weeks Range 13.97 - 43.55 | Updated Date 06/29/2025 | ||
Dividends yield (FY) 1.56% | Basic EPS (TTM) 1.28 |
Analyzing Revenue: Products, Geography and Growth
Revenue by Products
Product revenue - Year on Year
Revenue by Geography
Geography revenue - Year on Year
Earnings Date
Report Date - | When - | Estimate - | Actual - |
Profitability
Profit Margin 5.04% | Operating Margin (TTM) 2.38% |
Management Effectiveness
Return on Assets (TTM) 3.65% | Return on Equity (TTM) 7.73% |
Valuation
Trailing PE 16.52 | Forward PE 22.42 | Enterprise Value 4945418491 | Price to Sales(TTM) 0.83 |
Enterprise Value 4945418491 | Price to Sales(TTM) 0.83 | ||
Enterprise Value to Revenue 0.79 | Enterprise Value to EBITDA 4.69 | Shares Outstanding 247056000 | Shares Floating 102926120 |
Shares Outstanding 247056000 | Shares Floating 102926120 | ||
Percent Insiders 54.76 | Percent Institutions 45.22 |
Analyst Ratings
Rating 3 | Target Price 22.29 | Buy 3 | Strong Buy 2 |
Buy 3 | Strong Buy 2 | ||
Hold 4 | Sell - | Strong Sell - | |
Strong Sell - |
Upturn AI SWOT
Amkor Technology Inc
Company Overview
History and Background
Amkor Technology, Inc. was founded in 1968. Initially, it focused on assembling integrated circuits in South Korea. Over time, it expanded its services and global footprint to become a leading outsourced semiconductor assembly and test (OSAT) provider. Key milestones include establishing a significant presence in various Asian countries and expanding its technology portfolio through strategic acquisitions and innovations.
Core Business Areas
- Advanced Packaging: Offers advanced packaging technologies such as flip chip, wafer-level packaging, and 2.5D/3D packaging for high-performance applications.
- Mainstream Packaging: Provides a wide range of mainstream packaging solutions, including leadframe, laminate, and ball grid array (BGA) packages for diverse applications.
- Test Services: Offers comprehensive testing services, including wafer probe, final test, and system-level test, ensuring product quality and reliability.
Leadership and Structure
The CEO of Amkor Technology Inc. is Giel Rutten. The organizational structure comprises various business units focused on specific packaging technologies and geographic regions, supported by functional departments such as finance, operations, and sales.
Top Products and Market Share
Key Offerings
- Flip Chip Ball Grid Array (FCBGA): FCBGA packages are used for high-performance computing and networking applications. Competitors include ASE, Powertech Technology, and JCET. Market share data for this specific product line is not publicly broken out by Amkor.
- Wafer-Level Chip Scale Packaging (WLCSP): WLCSP offers small form factor and high-performance capabilities. Competitors include TSMC, STATS ChipPAC, and UTAC. Market share data for this specific product line is not publicly broken out by Amkor.
Market Dynamics
Industry Overview
The OSAT industry is driven by the increasing complexity of semiconductor devices and the growing demand for outsourced assembly and test services. Key trends include the adoption of advanced packaging technologies and the consolidation of the OSAT market.
Positioning
Amkor Technology Inc. is a leading player in the OSAT industry, known for its broad technology portfolio, global manufacturing footprint, and strong customer relationships. Its competitive advantages include its advanced packaging capabilities and its ability to provide end-to-end solutions.
Total Addressable Market (TAM)
The global OSAT market is projected to reach approximately $45 billion by 2024. Amkor is well positioned to capture a significant portion of this TAM, driven by the rising demand for advanced packaging solutions.
Upturn SWOT Analysis
Strengths
- Broad technology portfolio
- Global manufacturing footprint
- Strong customer relationships
- Advanced packaging capabilities
Weaknesses
- Exposure to cyclical semiconductor industry
- Dependence on key customers
- High capital expenditure requirements
Opportunities
- Growth in advanced packaging market
- Expansion into new geographic regions
- Increased outsourcing by IDMs
Threats
- Intense competition in the OSAT industry
- Economic downturns
- Technological disruptions
Competitors and Market Share
Key Competitors
- ASE (ASX)
- JCET (600584.SS)
- Powertech Technology Inc (6239.TWO)
Competitive Landscape
Amkor competes with other OSAT providers based on technology, capacity, and price. Amkor's strengths include its broad technology portfolio and global footprint, while its weaknesses include its exposure to the cyclical semiconductor industry.
Major Acquisitions
NANIUM S.A.
- Year: 2017
- Acquisition Price (USD millions): 170
- Strategic Rationale: Expanded Amkor's wafer-level packaging capabilities.
Growth Trajectory and Initiatives
Historical Growth: Amkor's revenue growth has been tied to the semiconductor industry cycle. There has been consistent growth in advanced packaging segment. The growth slowed down in 2023.
Future Projections: Analysts project moderate revenue growth for Amkor in the next few years, driven by the demand for advanced packaging solutions. EPS growth is expected to accelerate as profitability improves.
Recent Initiatives: Recent initiatives include investments in advanced packaging capacity, expansion into new markets, and strategic partnerships with key customers.
Summary
Amkor is a leading OSAT provider benefiting from the growing demand for advanced packaging. Financial performance is currently showing a year over year decline, but expected to improve. The company's strengths include its technology and global footprint. A key risk is its cyclical dependency on the semiconductor industry and competition in the space.
Peer Comparison
Sources and Disclaimers
Data Sources:
- Company filings, Analyst reports, Industry publications
- Market research reports
Disclaimers:
The data and analysis provided are for informational purposes only and should not be considered investment advice. Market share data are estimates and may vary.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About Amkor Technology Inc
Exchange NASDAQ | Headquaters Tempe, AZ, United States | ||
IPO Launch date 1998-04-29 | President, CEO & Director Mr. Guillaume Marie Jean Rutten | ||
Sector Technology | Industry Semiconductor Equipment & Materials | Full time employees 28300 | Website https://amkor.com |
Full time employees 28300 | Website https://amkor.com |
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
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