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Upturn AI SWOT - About
Amkor Technology Inc (AMKR)
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Upturn Advisory Summary
08/14/2025: AMKR (2-star) has a low Upturn Star Rating. Not recommended to BUY.
Upturn Star Rating
Below Average Performance
These Stocks/ETFs, based on Upturn Advisory, often underperform the market, warranting careful consideration before investing.
Number of Analysts
9 Analysts rated it
Limited analyst coverage, niche firm, research info may be scarce.
1 Year Target Price $24.38
1 Year Target Price $24.38
| 2 | Strong Buy |
| 3 | Buy |
| 4 | Hold |
| 0 | Sell |
| 0 | Strong Sell |
Analysis of Past Performance
Type Stock | Historic Profit 16.35% | Avg. Invested days 37 | Today’s Advisory Consider higher Upturn Star rating |
Upturn Star Rating | Upturn Advisory Performance  3.0 | Stock Returns Performance  2.0 |
| Profits based on simulation | Last Close 08/14/2025 |
Key Highlights
Company Size Mid-Cap Stock | Market Capitalization 6.06B USD | Price to earnings Ratio 20.1 | 1Y Target Price 24.38 |
Price to earnings Ratio 20.1 | 1Y Target Price 24.38 | ||
Volume (30-day avg) 9 | Beta 1.86 | 52 Weeks Range 13.97 - 32.86 | Updated Date 08/14/2025 |
52 Weeks Range 13.97 - 32.86 | Updated Date 08/14/2025 | ||
Dividends yield (FY) 1.31% | Basic EPS (TTM) 1.22 |
Analyzing Revenue: Products, Geography and Growth
Revenue by Products
Product revenue - Year on Year
Revenue by Geography
Geography revenue - Year on Year
Earnings Date
Report Date 2025-07-28 | When Before Market | Estimate 0.1584 | Actual 0.22 |
Profitability
Profit Margin 4.8% | Operating Margin (TTM) 6.08% |
Management Effectiveness
Return on Assets (TTM) 3.5% | Return on Equity (TTM) 7.35% |
Valuation
Trailing PE 20.1 | Forward PE 24.57 | Enterprise Value 5825632652 | Price to Sales(TTM) 0.96 |
Enterprise Value 5825632652 | Price to Sales(TTM) 0.96 | ||
Enterprise Value to Revenue 0.92 | Enterprise Value to EBITDA 5.47 | Shares Outstanding 247143008 | Shares Floating 161115029 |
Shares Outstanding 247143008 | Shares Floating 161115029 | ||
Percent Insiders 55.4 | Percent Institutions 46.2 |
Upturn AI SWOT
Amkor Technology Inc
Company Overview
History and Background
Amkor Technology, Inc. was founded in 1968. It has grown from a small assembly operation to a global leader in outsourced semiconductor packaging and test (OSAT) services, achieving significant milestones in technological innovation and market expansion.
Core Business Areas
- Packaging Services: Provides a wide array of packaging solutions, including advanced system-in-package (SiP), flip-chip, and leadframe packages.
- Test Services: Offers comprehensive testing services, including wafer probe, final test, and system-level test, ensuring the quality and reliability of semiconductor devices.
Leadership and Structure
The company is led by CEO Giel Rutten. The organizational structure includes various business units focused on specific technologies and geographic regions.
Top Products and Market Share
Key Offerings
- Flip Chip Ball Grid Array (FCBGA): High-performance packaging for processors, GPUs, and other high-end applications. Market share is estimated to be around 25-30% within the OSAT segment. Competitors include ASE, SPIL, and JCET.
- Leadframe Packages: Traditional packaging solutions used in automotive, industrial, and consumer electronics. Competitors are ASE, SPIL, and JCET.
- Wafer-Level Packaging (WLP): Package the product directly on the wafer for smartphones, wearables and similar small packages. Competitors are ASE, SPIL, and JCET.
Market Dynamics
Industry Overview
The OSAT industry is driven by the increasing complexity of semiconductor devices, the growing demand for miniaturization, and the rising costs of in-house manufacturing. Demand for advanced packaging is increasing.
Positioning
Amkor Technology is one of the largest OSAT providers globally, with a strong focus on advanced packaging technologies. Its competitive advantages include its broad portfolio, global footprint, and strong customer relationships.
Total Addressable Market (TAM)
The OSAT market is expected to reach over $50 billion by 2025. Amkor is well-positioned to capture a significant portion of this TAM due to its expertise in advanced packaging.
Upturn SWOT Analysis
Strengths
- Global presence
- Broad portfolio of packaging and test services
- Strong customer relationships
- Leadership in advanced packaging technologies
- Financial stability
Weaknesses
- Dependence on the semiconductor industry's cyclical nature
- High capital expenditure requirements
- Exposure to geopolitical risks
- Intense price competition
Opportunities
- Growth in advanced packaging technologies (e.g., 2.5D, 3D)
- Expansion into new markets (e.g., automotive, IoT)
- Increased outsourcing by IDMs (Integrated Device Manufacturers) and fabless companies
- Acquisitions of smaller competitors
Threats
- Economic downturns
- Technological disruptions
- Increased competition from other OSAT providers
- Trade restrictions and tariffs
Competitors and Market Share
Key Competitors
- ASE (ASX)
- SPIL (SPIL)
- JCET (600584.SS)
Competitive Landscape
Amkor is a leader in advanced packaging, but faces strong competition from ASE, SPIL and JCET. Each company has strengths in different areas, such as technology, cost, and geographic reach.
Growth Trajectory and Initiatives
Historical Growth: Amkor's growth has been driven by the increasing demand for advanced packaging and test services.
Future Projections: Analysts project continued growth for Amkor, driven by the expanding semiconductor market and the increasing complexity of devices. Estimates vary based on market conditions.
Recent Initiatives: Recent initiatives include investments in new technologies and capacity expansions in key regions.
Summary
Amkor is a major player in the growing OSAT market, benefiting from the increasing complexity of semiconductor devices. While its financial results fluctuate with semiconductor cycles, its investments in advanced technologies position it well for long-term growth. Competition remains intense, requiring continuous innovation and cost management. Future success depends on capitalizing on emerging opportunities in automotive, IoT, and other high-growth markets.
Peer Comparison
Sources and Disclaimers
Data Sources:
- Company Filings (SEC)
- Analyst Reports
- Industry Publications
Disclaimers:
The information provided is for informational purposes only and should not be considered financial advice. Market conditions and company performance are subject to change.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About Amkor Technology Inc
Exchange NASDAQ | Headquaters Tempe, AZ, United States | ||
IPO Launch date 1998-04-29 | President, CEO & Director Mr. Guillaume Marie Jean Rutten | ||
Sector Technology | Industry Semiconductor Equipment & Materials | Full time employees 28300 | Website https://amkor.com |
Full time employees 28300 | Website https://amkor.com | ||
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
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