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Upturn AI SWOT - About
AMKR 
Amkor Technology Inc (AMKR)
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Upturn Advisory Summary
09/12/2025: AMKR (2-star) has a low Upturn Star Rating. Not recommended to BUY.
Upturn Star Rating
Below Average Performance
These Stocks/ETFs, based on Upturn Advisory, often underperform the market, warranting careful consideration before investing.
Number of Analysts
9 Analysts rated it
Limited analyst coverage, niche firm, research info may be scarce.
1 Year Target Price $24.88
1 Year Target Price $24.88
| 2 | Strong Buy |
| 3 | Buy |
| 4 | Hold |
| 0 | Sell |
| 0 | Strong Sell |
Analysis of Past Performance
Type Stock | Historic Profit 21.24% | Avg. Invested days 40 | Today’s Advisory Consider higher Upturn Star rating |
Upturn Star Rating | Upturn Advisory Performance  3.0 | Stock Returns Performance  3.0 |
| Profits based on simulation | Last Close 09/12/2025 |
Key Highlights
Company Size Mid-Cap Stock | Market Capitalization 6.29B USD | Price to earnings Ratio 20.87 | 1Y Target Price 24.88 |
Price to earnings Ratio 20.87 | 1Y Target Price 24.88 | ||
Volume (30-day avg) 9 | Beta 1.97 | 52 Weeks Range 13.92 - 31.50 | Updated Date 09/14/2025 |
52 Weeks Range 13.92 - 31.50 | Updated Date 09/14/2025 | ||
Dividends yield (FY) 1.29% | Basic EPS (TTM) 1.22 |
Analyzing Revenue: Products, Geography and Growth
Revenue by Products
Product revenue - Year on Year
Revenue by Geography
Geography revenue - Year on Year
Earnings Date
Report Date - | When - | Estimate - | Actual - |
Profitability
Profit Margin 4.8% | Operating Margin (TTM) 6.08% |
Management Effectiveness
Return on Assets (TTM) 3.5% | Return on Equity (TTM) 7.35% |
Valuation
Trailing PE 20.87 | Forward PE 16.37 | Enterprise Value 5949204180 | Price to Sales(TTM) 0.99 |
Enterprise Value 5949204180 | Price to Sales(TTM) 0.99 | ||
Enterprise Value to Revenue 0.94 | Enterprise Value to EBITDA 5.58 | Shares Outstanding 247143008 | Shares Floating 161127386 |
Shares Outstanding 247143008 | Shares Floating 161127386 | ||
Percent Insiders 55.4 | Percent Institutions 46.83 |
Upturn AI SWOT
Amkor Technology Inc
Company Overview
History and Background
Amkor Technology, Inc. was founded in 1968 as Anam Semiconductor in South Korea. It evolved into a leading outsourced semiconductor assembly and test (OSAT) provider, expanding globally through strategic acquisitions and organic growth.
Core Business Areas
- Advanced Products: Provides advanced packaging and test services for high-performance applications, including flip chip, wafer-level packaging, and 2.5D/3D packaging.
- Mainstream Products: Offers a wide range of packaging and test services for diverse applications, including leadframe, laminate, and molded packages.
Leadership and Structure
Giel Rutten is the current President and CEO. The company operates with a functional organizational structure, dividing operations into product lines and geographic regions.
Top Products and Market Share
Key Offerings
- Flip Chip Ball Grid Array (FCBGA): Advanced packaging solution for high-performance computing and networking applications. Competitors include ASE, and Intel. Market share is estimated to be significant within their advanced packaging segment (difficult to precisely quantify).
- Wafer-Level Chip Scale Package (WLCSP): Small form factor packaging solution for mobile and consumer electronics. Competitors include TSMC and JCET. Again, market share within the overall WLCSP market is difficult to pinpoint precisely but Amkor is a major player.
- Quad Flat No-Lead (QFN): A popular leadframe package used in a variety of applications across different industries. This is a Mainstream Product. Competitors include Unisem and ChipMOS. The market share is difficult to pinpoint, as it is a widely adopted technology.
Market Dynamics
Industry Overview
The OSAT industry is driven by increasing demand for semiconductors, miniaturization, and advanced packaging technologies. Key trends include the growth of AI, 5G, and automotive electronics.
Positioning
Amkor is a leading OSAT provider, positioned as a technology innovator and a reliable partner for semiconductor manufacturers. They differentiate themselves through their broad portfolio and global footprint.
Total Addressable Market (TAM)
The global OSAT market is projected to reach hundreds of billions of dollars. Amkor's strong position allows it to capture a significant portion of this market, estimated to be approximately 25%.
Upturn SWOT Analysis
Strengths
- Broad portfolio of packaging and test solutions
- Global manufacturing footprint
- Strong relationships with leading semiconductor manufacturers
- Technology leadership in advanced packaging
Weaknesses
- Dependence on the semiconductor industry cycle
- High capital expenditure requirements
- Competition from other OSAT providers
- Exposure to geopolitical risks
Opportunities
- Growth in advanced packaging technologies
- Expansion into new markets (e.g., automotive, IoT)
- Strategic acquisitions
- Increased outsourcing by semiconductor manufacturers
Threats
- Economic downturns
- Increased competition
- Technological disruptions
- Geopolitical instability
- Supply chain disruptions
Competitors and Market Share
Key Competitors
- ASE (ASX)
- JCET (600584.SS)
- TSMC (TSM)
Competitive Landscape
Amkor is a leading OSAT provider, but faces intense competition from ASE, JCET and TSMC. Amkor differentiates itself through its broad portfolio, global footprint, and technology leadership.
Major Acquisitions
J-Devices Corporation
- Year: 2016
- Acquisition Price (USD millions): 230
- Strategic Rationale: Expanded Amkor's capacity and capabilities in Japan, strengthening its position in the automotive and industrial markets.
Growth Trajectory and Initiatives
Historical Growth: Amkor has experienced moderate growth in recent years, driven by the demand for advanced packaging solutions.
Future Projections: Analysts project continued growth, driven by the expansion of AI, 5G, and automotive electronics. Single-digit percentage growth year over year.
Recent Initiatives: Amkor has been investing in expanding its advanced packaging capabilities and expanding its global manufacturing footprint.
Summary
Amkor Technology, Inc. is a strong player in the OSAT industry with a broad portfolio and global footprint. It benefits from the growth in advanced packaging technologies, but faces competition and cyclical demand. Investing in technology and strategic expansion appears necessary for continued success. Keep an eye on increased competition for market share and technology disruption.
Peer Comparison
Sources and Disclaimers
Data Sources:
- Company Filings
- Market Research Reports
- Analyst Estimates
- Publicly Available Information
Disclaimers:
The information provided is for informational purposes only and should not be considered investment advice. Market share data may be estimated and may not be precise.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About Amkor Technology Inc
Exchange NASDAQ | Headquaters Tempe, AZ, United States | ||
IPO Launch date 1998-04-29 | President, CEO & Director Mr. Guillaume Marie Jean Rutten | ||
Sector Technology | Industry Semiconductor Equipment & Materials | Full time employees 28300 | Website https://amkor.com |
Full time employees 28300 | Website https://amkor.com | ||
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
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