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AMKR 5-star rating from Upturn Advisory
Amkor Technology Inc (AMKR) company logo

Amkor Technology Inc (AMKR)

Amkor Technology Inc (AMKR) 5-star rating from Upturn Advisory
$48.52
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Upturn Advisory Summary

02/26/2026: AMKR (5-star) is currently NOT-A-BUY. Pass it for now.

Upturn Star Rating

Upturn 5 star rating for performance

Outstanding Performance

These Stocks/ETFs, based on Upturn Advisory, have historically outperformed the market, making them a top-tier choice for investors.

Number of Analysts

2 star rating from financial analysts

9 Analysts rated it

Limited analyst coverage, niche firm, research info may be scarce.

1 Year Target Price $56.25

1 Year Target Price $56.25

Analysts Price Target For last 52 week
$56.25 Target price
52w Low $13.89
Current$48.52
52w High $57.09
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Key Highlights

Company Size Large-Cap Stock
Market Capitalization 12.60B USD
Price to earnings Ratio 33.96
1Y Target Price 56.25
Price to earnings Ratio 33.96
1Y Target Price 56.25
Volume (30-day avg) 9
Beta 1.95
52 Weeks Range 13.89 - 57.09
Updated Date 02/25/2026
52 Weeks Range 13.89 - 57.09
Updated Date 02/25/2026
Dividends yield (FY) 0.68%
Basic EPS (TTM) 1.5

Analyzing Revenue: Products, Geography and Growth

Revenue by Products

Product revenue - Year on Year

Revenue by Geography

Geography revenue - Year on Year

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Earnings Date

Report Date 2026-02-10
When -
Estimate 0.441
Actual 0.69

Profitability

Profit Margin 5.57%
Operating Margin (TTM) 9.77%

Management Effectiveness

Return on Assets (TTM) 3.87%
Return on Equity (TTM) 8.66%

Valuation

Trailing PE 33.96
Forward PE 19.05
Enterprise Value 6982262150
Price to Sales(TTM) 1.88
Enterprise Value 6982262150
Price to Sales(TTM) 1.88
Enterprise Value to Revenue 1.1
Enterprise Value to EBITDA 6.55
Shares Outstanding 247309063
Shares Floating 122007453
Shares Outstanding 247309063
Shares Floating 122007453
Percent Insiders 49.92
Percent Institutions 46.7

Icon representing Upturn AI-generated SWOT analysis summary Upturn AI SWOT

Amkor Technology Inc

Amkor Technology Inc(AMKR) company logo displayed in Upturn AI summary

Company Overview

Company history and background logo History and Background

Amkor Technology Inc. was founded in 1968 by John T. Amkorgol. It is a leading provider of semiconductor packaging and test services. Over the years, Amkor has evolved from a simple assembly house to a comprehensive solutions provider, offering a wide range of advanced packaging technologies to support the growing demands of the semiconductor industry. Key milestones include its expansion into global markets and its development of innovative packaging solutions for complex integrated circuits.

Company business area logo Core Business Areas

  • Advanced Packaging: Amkor designs, manufactures, and sells advanced semiconductor packaging solutions, including flip-chip, wire-bond, and wafer-level packaging. These are critical for high-performance applications such as mobile devices, automotive electronics, and artificial intelligence.
  • Outsourced Semiconductor Assembly and Test (OSAT) Services: Amkor provides a comprehensive suite of OSAT services, including leadframe, substrate, and leaded package assembly, as well as a full spectrum of semiconductor test services. This allows fabless companies and integrated device manufacturers (IDMs) to outsource their manufacturing and testing needs.
  • Materials and Equipment: The company also offers specialized semiconductor materials and equipment, further supporting the semiconductor manufacturing ecosystem.

leadership logo Leadership and Structure

Amkor Technology Inc. is led by a seasoned management team. The current CEO is Ronald K. Amerson. The company operates globally with manufacturing and sales facilities in key semiconductor hubs across Asia, North America, and Europe. Its organizational structure is geared towards providing integrated solutions and customer support throughout the semiconductor product lifecycle.

Top Products and Market Share

Product Key Offerings logo Key Offerings

  • Amkor's Advanced Packaging Portfolio: Includes various technologies like flip-chip, wafer-level packaging (WLP), fan-out WLP, and advanced substrate-based packages. These are crucial for miniaturization, performance enhancement, and thermal management in modern electronics. Amkor holds a significant market share in advanced packaging solutions, competing with companies like ASE Technology Holding and JCET Group. Specific revenue figures for individual products are not publicly disclosed, but the advanced packaging segment is a major revenue driver.
  • Leaded Package Solutions: Amkor continues to offer a range of traditional leaded packages such as QFP and SOP, which are still widely used in many consumer and industrial applications. Competitors include many other OSAT providers.
  • Test Services: Amkor provides comprehensive final test services for a wide array of semiconductor devices, supporting both wafer-level and package-level testing. This is a critical component of the OSAT offering, with competitors including Test Industry and others.

Market Dynamics

industry overview logo Industry Overview

The semiconductor packaging industry is a critical and growing segment of the global semiconductor market. It is characterized by rapid technological innovation, increasing demand for higher performance and smaller form factors, and a trend towards advanced packaging solutions like 2.5D and 3D integration. Geopolitical factors and supply chain resilience are also significant considerations. The industry is highly competitive and capital-intensive, with significant R&D investment required.

Positioning

Amkor Technology Inc. is a leading global player in the outsourced semiconductor assembly and test (OSAT) market. Its competitive advantages include its extensive portfolio of advanced packaging technologies, strong customer relationships with major semiconductor companies, global manufacturing footprint, and commitment to innovation. The company is well-positioned to capitalize on the growing demand for high-performance and specialized semiconductor packaging.

Total Addressable Market (TAM)

The global semiconductor packaging market is substantial and growing, with projections often placing it in the tens of billions of USD annually. Amkor Technology Inc., as a major OSAT provider, addresses a significant portion of this TAM. Its positioning is that of a top-tier solutions provider, aiming to capture a substantial share through its broad technological capabilities and customer base.

Upturn SWOT Analysis

Strengths

  • Strong global manufacturing and R&D footprint
  • Diverse and advanced packaging technology portfolio
  • Long-standing relationships with major semiconductor customers
  • Reputation for quality and reliability
  • Economies of scale in operations

Weaknesses

  • Reliance on a few key customers
  • Susceptibility to industry cyclicality
  • Intense competition from other OSAT providers
  • Capital-intensive nature of the business

Opportunities

  • Growing demand for advanced packaging in AI, 5G, and IoT
  • Expansion into emerging markets and new applications
  • Strategic partnerships and collaborations
  • Increased outsourcing by fabless companies
  • Development of sustainable packaging solutions

Threats

  • Global economic downturns impacting semiconductor demand
  • Geopolitical tensions and trade wars affecting supply chains
  • Rapid technological obsolescence requiring continuous R&D investment
  • Price pressure from competitors
  • Shortages of key materials and skilled labor

Competitors and Market Share

Key competitor logo Key Competitors

  • ASE Technology Holding Co., Ltd. (ASX)
  • JCET Group Co., Ltd. (SSE: 600584)
  • Siliconware Precision Industries Co., Ltd. (SPIL, part of ASE)
  • Amkor Technology Inc. (AMKR)

Competitive Landscape

Amkor Technology Inc. competes in a consolidated yet highly competitive OSAT market. Its advantages lie in its technological breadth, global reach, and strong customer relationships. However, it faces pressure from larger competitors like ASE Technology Holding and Chinese players like JCET Group, which benefit from significant scale and government support. Differentiation through advanced technology, service, and reliability is key to maintaining its market position.

Major Acquisitions

N/A - Amkor Technology primarily grows organically and through strategic partnerships rather than large-scale acquisitions in recent years. Previous smaller integrations or technology acquisitions may have occurred but are not widely publicized as major strategic shifts.

  • Year:
  • Acquisition Price (USD millions):
  • Strategic Rationale:

Growth Trajectory and Initiatives

Historical Growth: Amkor Technology Inc. has demonstrated historical growth driven by the expansion of the semiconductor industry and its ability to innovate in packaging technologies. Growth has often been linked to increased demand from key sectors like consumer electronics, automotive, and computing.

Future Projections: Future growth projections for Amkor Technology Inc. are generally positive, supported by the sustained demand for advanced semiconductors and packaging solutions in emerging technologies like AI, 5G, and electric vehicles. Analyst consensus typically points towards continued revenue growth and profitability improvements, contingent on market dynamics and competitive pressures.

Recent Initiatives: Recent strategic initiatives by Amkor Technology Inc. may include investments in new manufacturing capacity, development of next-generation packaging technologies (e.g., heterogeneous integration), and expansion of its service offerings to provide more integrated solutions to customers.

Summary

Amkor Technology Inc. is a strong player in the critical semiconductor packaging industry, leveraging its advanced technologies and global footprint. The company benefits from robust demand in high-growth sectors like AI and 5G. However, it faces intense competition and market cyclicality. Continued investment in R&D and strategic customer partnerships are key to maintaining its competitive edge and navigating future challenges.

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Sources and Disclaimers

Data Sources:

  • Amkor Technology Inc. Investor Relations
  • Industry analyst reports (e.g., Gartner, IDC)
  • Financial news outlets (e.g., Bloomberg, Reuters)
  • Company SEC filings (10-K, 10-Q)

Disclaimers:

This JSON output is based on publicly available information and general industry knowledge as of the last update. It is intended for informational purposes only and does not constitute financial advice. Market share data and financial figures are estimates and can vary. Investors should conduct their own due diligence before making any investment decisions.

Information icon for Upturn AI Summarization accuracy disclaimer AI Summarization is directionally correct and might not be accurate.

Information icon for Upturn AI Summarization data freshness disclaimer Summarized information shown could be a few years old and not current.

Information icon warning about Upturn AI Fundamental Rating based on potentially old data Fundamental Rating based on AI could be based on old data.

Information icon warning about potential inaccuracies or hallucinations in Upturn AI-generated summaries AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.

About Amkor Technology Inc

Exchange NASDAQ
Headquaters Tempe, AZ, United States
IPO Launch date 1998-04-29
CEO & President Mr. Kevin K. Engel
Sector Technology
Industry Semiconductor Equipment & Materials
Full time employees 30800
Full time employees 30800

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.