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Upturn AI SWOT - About
ChipMOS Technologies Inc (IMOS)
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Upturn Advisory Summary
08/28/2025: IMOS (1-star) is currently NOT-A-BUY. Pass it for now.
Upturn Star Rating
Not Recommended Performance
These Stocks/ETFs, based on Upturn Advisory, consistently fall short of market performance, signaling caution before investing.
Analysis of Past Performance
Type Stock | Historic Profit -10.75% | Avg. Invested days 44 | Today’s Advisory PASS |
Upturn Star Rating | Upturn Advisory Performance  2.0 | Stock Returns Performance  1.0 |
| Profits based on simulation | Last Close 08/28/2025 |
Key Highlights
Company Size Small-Cap Stock | Market Capitalization 673.53M USD | Price to earnings Ratio 13.92 | 1Y Target Price 20 |
Price to earnings Ratio 13.92 | 1Y Target Price 20 | ||
Volume (30-day avg) - | Beta 0.45 | 52 Weeks Range 12.24 - 25.78 | Updated Date 06/29/2025 |
52 Weeks Range 12.24 - 25.78 | Updated Date 06/29/2025 | ||
Dividends yield (FY) 4.43% | Basic EPS (TTM) 1.33 |
Earnings Date
Report Date - | When - | Estimate - | Actual - |
Profitability
Profit Margin 5.08% | Operating Margin (TTM) 1.72% |
Management Effectiveness
Return on Assets (TTM) 1.44% | Return on Equity (TTM) 4.61% |
Valuation
Trailing PE 13.92 | Forward PE 11.38 | Enterprise Value 669156297 | Price to Sales(TTM) 0.03 |
Enterprise Value 669156297 | Price to Sales(TTM) 0.03 | ||
Enterprise Value to Revenue 0.85 | Enterprise Value to EBITDA 2.85 | Shares Outstanding 35862000 | Shares Floating 575291032 |
Shares Outstanding 35862000 | Shares Floating 575291032 | ||
Percent Insiders - | Percent Institutions 6.3 |
Upturn AI SWOT
ChipMOS Technologies Inc
Company Overview
History and Background
ChipMOS Technologies Inc. was founded in 1997. It is a leading provider of outsourced semiconductor assembly and test services (OSAT). It initially focused on memory products and has expanded into display driver ICs and mixed-signal products.
Core Business Areas
- Memory Testing and Assembly: Provides testing and assembly services for various memory products, including DRAM, Flash, and other memory types.
- Mixed-Signal Testing and Assembly: Offers testing and assembly solutions for mixed-signal integrated circuits, which combine analog and digital functions.
- Display Driver IC Testing and Assembly: Specializes in testing and assembly services for display driver ICs used in various display applications.
Leadership and Structure
S.J. Cheng serves as the Chairman and President of ChipMOS Technologies Inc. The company has a board of directors and operates through various business units focused on specific service offerings.
Top Products and Market Share
Key Offerings
- DRAM Testing and Assembly: ChipMOS provides testing and assembly for DRAM (Dynamic Random-Access Memory) used in computers, servers, and mobile devices. Competitors include ASE, Amkor, and Powertech. Market share is estimated to be in the 5-10% range.
- Flash Memory Testing and Assembly: ChipMOS offers testing and assembly for Flash memory, which is commonly used in storage devices like SSDs and USB drives. Competitors include ASE, Amkor, and Powertech. Market share is estimated to be in the 5-10% range.
- Display Driver IC Testing and Assembly: ChipMOS provides testing and assembly services for display driver ICs (DDICs), which control the pixels in displays. Competitors include Chipbond and PTI. Market share is estimated to be in the 10-15% range.
Market Dynamics
Industry Overview
The OSAT industry is highly competitive and influenced by global semiconductor demand, technological advancements, and macroeconomic factors. Growth is driven by increasing complexity of ICs and growing demand for electronics.
Positioning
ChipMOS is a mid-sized OSAT player focused on memory and display driver ICs. Its competitive advantages include its specialization in these areas and strong relationships with key customers.
Total Addressable Market (TAM)
The OSAT market is projected to reach hundreds of billions of USD. ChipMOS's portion depends on memory and display driver IC segment growth.
Upturn SWOT Analysis
Strengths
- Specialization in memory and display driver IC testing and assembly
- Established relationships with leading semiconductor manufacturers
- Advanced testing capabilities
- Geographic proximity to key customers in Taiwan and Asia
Weaknesses
- Smaller scale compared to larger OSAT players
- Limited diversification beyond memory and display driver ICs
- Susceptible to fluctuations in memory market demand
Opportunities
- Growth in demand for advanced memory technologies
- Expansion into new applications for display driver ICs
- Increasing outsourcing of testing and assembly services
- Strategic partnerships with other companies in the semiconductor ecosystem
Threats
- Intense competition from larger OSAT players
- Technological obsolescence
- Economic downturns
- Geopolitical risks
- Supply Chain Disruptions
Competitors and Market Share
Key Competitors
- ASE (ASX)
- Amkor Technology (AMKR)
- Powertech Technology Inc. (PTI)
Competitive Landscape
ChipMOS competes with larger OSAT players that have greater resources and broader service offerings. ChipMOS's advantage lies in its specialization and customer relationships.
Growth Trajectory and Initiatives
Historical Growth: ChipMOS's growth has been influenced by the growth of the memory and display driver IC markets.
Future Projections: Analyst projections for ChipMOS's future growth depend on the overall semiconductor market conditions and the company's ability to capitalize on growth opportunities.
Recent Initiatives: Recent initiatives may include expanding capacity, investing in new technologies, and strengthening customer relationships.
Summary
ChipMOS Technologies Inc. is a mid-sized player in the OSAT industry specializing in memory and display driver IC testing and assembly. The company benefits from its specialization, established customer relationships, and proximity to key markets. However, it faces challenges from larger competitors, market fluctuations, and technological advancements. ChipMOS needs to continue investing in new technologies and expanding its customer base to maintain its competitiveness and drive future growth.
Peer Comparison
Sources and Disclaimers
Data Sources:
- Company Website
- SEC Filings
- Industry Reports
- Analyst Reports
Disclaimers:
The information provided is for informational purposes only and should not be considered as investment advice. Market share data are estimates and may not be precise. Financial data may be outdated.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About ChipMOS Technologies Inc
Exchange NASDAQ | Headquaters - | ||
IPO Launch date 2001-06-19 | Chairman, CEO & President Mr. Shih-Jye Cheng | ||
Sector Technology | Industry Semiconductors | Full time employees - | Website https://www.chipmos.com |
Full time employees - | Website https://www.chipmos.com | ||
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
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