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ChipMOS Technologies Inc (IMOS)

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Upturn Advisory Summary
12/12/2025: IMOS (1-star) has a low Upturn Star Rating. Not recommended to BUY.
Analysis of Past Performance
Type Stock | Historic Profit 38.23% | Avg. Invested days 47 | Today’s Advisory Consider higher Upturn Star rating |
Upturn Star Rating ![]() | Upturn Advisory Performance | Stock Returns Performance |
Key Highlights
Company Size Small-Cap Stock | Market Capitalization 673.53M USD | Price to earnings Ratio 13.92 | 1Y Target Price 20 |
Price to earnings Ratio 13.92 | 1Y Target Price 20 | ||
Volume (30-day avg) - | Beta 0.45 | 52 Weeks Range 12.24 - 25.78 | Updated Date 06/29/2025 |
52 Weeks Range 12.24 - 25.78 | Updated Date 06/29/2025 | ||
Dividends yield (FY) 4.43% | Basic EPS (TTM) 1.33 |
Earnings Date
Report Date - | When - | Estimate - | Actual - |
Profitability
Profit Margin 5.08% | Operating Margin (TTM) 1.72% |
Management Effectiveness
Return on Assets (TTM) 1.44% | Return on Equity (TTM) 4.61% |
Valuation
Trailing PE 13.92 | Forward PE 11.38 | Enterprise Value 669156297 | Price to Sales(TTM) 0.03 |
Enterprise Value 669156297 | Price to Sales(TTM) 0.03 | ||
Enterprise Value to Revenue 0.85 | Enterprise Value to EBITDA 2.85 | Shares Outstanding 35862000 | Shares Floating 575291032 |
Shares Outstanding 35862000 | Shares Floating 575291032 | ||
Percent Insiders - | Percent Institutions 6.3 |
About ChipMOS Technologies Inc
Exchange NASDAQ | Headquaters - | ||
IPO Launch date 2001-06-19 | Chairman, CEO & President Mr. Shih-Jye Cheng | ||
Sector Technology | Industry Semiconductors | Full time employees - | Website https://www.chipmos.com |
Full time employees - | Website https://www.chipmos.com | ||
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

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