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IMOS
Upturn stock ratingUpturn stock rating

ChipMOS Technologies Inc (IMOS)

Upturn stock ratingUpturn stock rating
$18.11
Last Close (24-hour delay)
Profit since last BUY4.14%
upturn advisory
Consider higher Upturn Star rating
BUY since 33 days
  • BUY Advisory
  • SELL Advisory (Profit)​
  • SELL Advisory (Loss)​
  • Profit
  • Loss
  • Pass (Skip investing)
Upturn Stock infoUpturn Stock info Stock price based on last close
*as per simulation
(see disclosures)
Time period over
  • ALL
  • YEAR
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Upturn Advisory Summary

06/30/2025: IMOS (1-star) has a low Upturn Star Rating. Not recommended to BUY.

Upturn Star Rating

rating

Not Recommended Performance

These Stocks/ETFs, based on Upturn Advisory, consistently fall short of market performance, signaling caution before investing.

Number of Analysts

rating

Analysts rated it

Very few follow this stock; limited insights, higher-risk early investing.

1 Year Target Price $20

1 Year Target Price $20

Analysts Price Target For last 52 week
$20Target price
Low$
Current$18.11
high$

Analysis of Past Performance

Type Stock
Historic Profit -8.63%
Avg. Invested days 42
Today’s Advisory Consider higher Upturn Star rating
Upturn Star Rating Upturn stock ratingUpturn stock rating
Upturn Advisory Performance Upturn Advisory Performance 2.0
Stock Returns Performance Upturn Returns Performance 1.0
Upturn Profits based on simulationUpturn Profits based on simulation Profits based on simulation
Upturn Profits based on simulationUpturn Profits based on simulation Last Close 06/30/2025

Key Highlights

Company Size Small-Cap Stock
Market Capitalization 673.53M USD
Price to earnings Ratio 13.92
1Y Target Price 20
Price to earnings Ratio 13.92
1Y Target Price 20
Volume (30-day avg) -
Beta 0.45
52 Weeks Range 12.24 - 25.78
Updated Date 06/29/2025
52 Weeks Range 12.24 - 25.78
Updated Date 06/29/2025
Dividends yield (FY) 4.43%
Basic EPS (TTM) 1.33

Earnings Date

Report Date -
When -
Estimate -
Actual -

Profitability

Profit Margin 5.08%
Operating Margin (TTM) 1.72%

Management Effectiveness

Return on Assets (TTM) 1.44%
Return on Equity (TTM) 4.61%

Valuation

Trailing PE 13.92
Forward PE 11.38
Enterprise Value 669156297
Price to Sales(TTM) 0.03
Enterprise Value 669156297
Price to Sales(TTM) 0.03
Enterprise Value to Revenue 0.85
Enterprise Value to EBITDA 2.85
Shares Outstanding 35862000
Shares Floating 575291032
Shares Outstanding 35862000
Shares Floating 575291032
Percent Insiders -
Percent Institutions 6.3

Analyst Ratings

Rating -
Target Price 20
Buy -
Strong Buy -
Buy -
Strong Buy -
Hold -
Sell -
Strong Sell -
Strong Sell -

ai summary icon Upturn AI SWOT

ChipMOS Technologies Inc

stock logo

Company Overview

overview logo History and Background

ChipMOS Technologies Inc. was founded in 1997. It is a leading provider of outsourced semiconductor assembly and testing services (OSAT). ChipMOS has grown through strategic investments and acquisitions, establishing itself as a key player in the memory and mixed-signal markets.

business area logo Core Business Areas

  • Assembly: Provides assembly services for various semiconductor devices, including memory and mixed-signal ICs. This includes packaging the chips and preparing them for use in electronic devices.
  • Testing: Offers a range of testing services to ensure the quality and reliability of semiconductor devices. Testing includes both wafer testing and final testing of assembled devices.
  • Engineering Services: Provides engineering support to customers throughout the assembly and testing process, including test program development, failure analysis, and process optimization.

leadership logo Leadership and Structure

S.J. Cheng is currently the Chairman and President. The company operates with a functional organizational structure, dividing its operations into Assembly, Testing, and related support functions such as Engineering, Sales, and Finance.

Top Products and Market Share

overview logo Key Offerings

  • Memory Testing: Testing of various memory chips including DRAM, Flash memory (NAND and NOR). ChipMOS is a significant player in the memory testing market, particularly for high-bandwidth memory (HBM) and DDR5 memory. Competitors include ASE and Powertech Technology. Market share data is proprietary but considered to be a significant portion of the DRAM and Flash memory testing market.
  • Mixed-Signal Testing: Testing of mixed-signal integrated circuits. This includes testing for power management ICs and other mixed-signal devices that combine analog and digital functionality. Competitors include Teradyne and Advantest. Market share is smaller relative to memory testing but a growing area of focus for ChipMOS.
  • LCD Driver IC Assembly and Testing: Assembly and testing services for LCD driver ICs, which are used in displays for mobile devices, TVs, and other electronic products. Market share data is proprietary but ChipMOS is one of the major OSAT providers in this segment. Competitors include Chipbond Technology.

Market Dynamics

industry overview logo Industry Overview

The OSAT industry is highly competitive and driven by the growth of the semiconductor market. Key trends include increasing demand for advanced packaging technologies, growing complexity of IC testing, and rising demand for outsourced services from fabless semiconductor companies.

Positioning

ChipMOS is positioned as a leading provider of assembly and testing services, particularly for memory devices. Its competitive advantages include its strong technical expertise, established customer relationships, and focus on high-growth markets such as high-bandwidth memory.

Total Addressable Market (TAM)

The global OSAT market is estimated to be over $40 billion. ChipMOS, with its specialized focus on memory and mixed-signal segments, is well-positioned to capture a significant share of this TAM, particularly as memory and advanced packaging needs grow. Exact share is proprietary but ChipMOS targets a sizable portion of the relevant segments.

Upturn SWOT Analysis

Strengths

  • Strong expertise in memory assembly and testing
  • Established customer relationships with leading semiconductor manufacturers
  • Focus on high-growth markets like HBM and DDR5
  • Advanced packaging capabilities

Weaknesses

  • Concentration in the memory market makes it vulnerable to memory market cycles
  • Limited diversification into other semiconductor segments
  • Smaller scale compared to larger OSAT providers like ASE
  • Geographic concentration in Asia

Opportunities

  • Growing demand for advanced packaging technologies
  • Expansion into new semiconductor segments (e.g., automotive)
  • Increased outsourcing of assembly and testing services
  • Growth in the high-bandwidth memory (HBM) market

Threats

  • Intense competition from other OSAT providers
  • Cyclical nature of the semiconductor industry
  • Technological changes in packaging and testing
  • Economic downturns

Competitors and Market Share

competitor logo Key Competitors

  • ASE (ASX)
  • Powertech Technology (6239.TW)
  • Amkor Technology (AMKR)

Competitive Landscape

ChipMOS focuses on niche markets like memory and LCD driver IC assembly/testing, distinguishing itself from larger, more diversified OSAT companies. While smaller than ASE and Amkor, ChipMOS holds a significant position in its chosen segments due to its technical expertise and established customer base. It aims to capitalize on the growth of HBM and DDR5 memory.

Growth Trajectory and Initiatives

Historical Growth: Historical growth requires access to financial data sources.

Future Projections: Future projections are dependent on analyst estimates that change frequently.

Recent Initiatives: Recent initiatives include expansion of its testing capabilities for advanced memory devices and strategic partnerships to expand its customer base.

Summary

ChipMOS Technologies is a key player in the memory and mixed-signal OSAT market. Its focus on high-growth segments like HBM and DDR5 memory is promising. The company's smaller scale and reliance on memory markets are vulnerabilities. They must continue to diversify to remain relevant.

Peer Comparison

Sources and Disclaimers

Data Sources:

  • Company website
  • Industry reports
  • Analyst reports (estimates)
  • Financial news sources

Disclaimers:

The information provided is for general informational purposes only and should not be considered as financial advice. Market share data is based on estimates and may not be precise. Real-time financial data was not available for this AI exercise.

Upturn AI SummarizationUpturn AI Summarization AI Summarization is directionally correct and might not be accurate.

Upturn AI SummarizationUpturn AI Summarization Summarized information shown could be a few years old and not current.

Upturn AI SummarizationUpturn AI Summarization Fundamental Rating based on AI could be based on old data.

Upturn AI SummarizationUpturn AI Summarization AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.

About ChipMOS Technologies Inc

Exchange NASDAQ
Headquaters -
IPO Launch date 2001-06-19
Chairman, CEO & President Mr. Shih-Jye Cheng
Sector Technology
Industry Semiconductors
Full time employees -
Full time employees -

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.