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ChipMOS Technologies Inc (IMOS)
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Upturn Advisory Summary
01/09/2026: IMOS (2-star) has a low Upturn Star Rating. Not recommended to BUY.
Upturn Star Rating
Below Average Performance
These Stocks/ETFs, based on Upturn Advisory, often underperform the market, warranting careful consideration before investing.
Analysis of Past Performance
Type Stock | Historic Profit 75.06% | Avg. Invested days 49 | Today’s Advisory Consider higher Upturn Star rating |
Upturn Star Rating | Upturn Advisory Performance  3.0 | Stock Returns Performance  4.0 |
| Profits based on simulation | Last Close 01/09/2026 |
Key Highlights
Company Size Small-Cap Stock | Market Capitalization 673.53M USD | Price to earnings Ratio 13.92 | 1Y Target Price 20 |
Price to earnings Ratio 13.92 | 1Y Target Price 20 | ||
Volume (30-day avg) - | Beta 0.45 | 52 Weeks Range 12.24 - 25.78 | Updated Date 06/29/2025 |
52 Weeks Range 12.24 - 25.78 | Updated Date 06/29/2025 | ||
Dividends yield (FY) 4.43% | Basic EPS (TTM) 1.33 |
Earnings Date
Report Date - | When - | Estimate - | Actual - |
Profitability
Profit Margin 5.08% | Operating Margin (TTM) 1.72% |
Management Effectiveness
Return on Assets (TTM) 1.44% | Return on Equity (TTM) 4.61% |
Valuation
Trailing PE 13.92 | Forward PE 11.38 | Enterprise Value 669156297 | Price to Sales(TTM) 0.03 |
Enterprise Value 669156297 | Price to Sales(TTM) 0.03 | ||
Enterprise Value to Revenue 0.85 | Enterprise Value to EBITDA 2.85 | Shares Outstanding 35862000 | Shares Floating 575291032 |
Shares Outstanding 35862000 | Shares Floating 575291032 | ||
Percent Insiders - | Percent Institutions 6.3 |
Upturn AI SWOT
ChipMOS Technologies Inc
Company Overview
History and Background
ChipMOS Technologies Inc. was founded in 1997 as a spin-off from United Microelectronics Corporation (UMC). It has since established itself as a leading provider of semiconductor assembly and testing services. The company has undergone significant expansion and technological advancements, becoming a crucial player in the global semiconductor supply chain.
Core Business Areas
- Assembly Services: ChipMOS offers a comprehensive range of semiconductor assembly services, including lead frame package assembly, wire bonding, encapsulation, and final testing. These services are essential for protecting and interconnecting integrated circuits.
- Testing Services: The company provides various testing services, such as wafer probing, final test, and burn-in testing, to ensure the quality, reliability, and performance of semiconductor devices.
- Bumping and Redistribution Layer (RDL) Services: ChipMOS is a significant provider of wafer-level bumping and RDL services, which are critical for advanced packaging solutions like flip-chip technology, enabling higher density and performance.
Leadership and Structure
ChipMOS Technologies Inc. is led by a management team with extensive experience in the semiconductor industry. The organizational structure is designed to support its specialized assembly and testing operations, with dedicated divisions for different service types and customer segments.
Top Products and Market Share
Key Offerings
- Lead Frame Package Assembly: ChipMOS provides assembly for a wide array of lead frame-based packages, including QFP, SOP, and TSSOP, catering to diverse applications. Competitors include ASE Technology Holding Co., Ltd. (ASX), Amkor Technology (AMKR), and JCET Group.
- Wafer Level Bumping and RDL: This advanced service is crucial for high-performance chips used in smartphones, servers, and AI applications. ChipMOS is a major player in this segment, competing with companies like TSMC (TSM) and Samsung Electro-Mechanics.
- Final Test Services: Ensuring the functionality and reliability of finished semiconductor devices through various testing methodologies. Key competitors include VeriSilicon Holdings Co., Ltd. (VZSC) and other independent test houses.
Market Dynamics
Industry Overview
The semiconductor assembly and testing (OSAT) industry is a critical but often overlooked segment of the semiconductor supply chain. It is characterized by high capital intensity, technological innovation, and intense competition. Growth is driven by increasing demand for electronic devices across consumer, automotive, and industrial sectors, as well as the trend towards advanced packaging solutions.
Positioning
ChipMOS Technologies Inc. is a leading OSAT provider, particularly strong in wafer-level packaging and advanced bumping services. Its competitive advantages lie in its technological expertise, high-volume manufacturing capabilities, and established relationships with major semiconductor manufacturers. The company is well-positioned to benefit from the growing demand for advanced packaging.
Total Addressable Market (TAM)
The global OSAT market is projected to grow significantly, with estimates varying but generally reaching tens of billions of USD annually, driven by AI, 5G, automotive electronics, and IoT. ChipMOS holds a substantial share within its specialized segments and is well-positioned to capture a growing portion of this TAM due to its advanced capabilities.
Upturn SWOT Analysis
Strengths
- Strong technological expertise in advanced packaging solutions like bumping and RDL.
- Significant manufacturing capacity and economies of scale.
- Long-standing relationships with major semiconductor clients.
- Vertical integration of assembly and testing services.
- Reputation for quality and reliability.
Weaknesses
- Dependence on a few major customers, which can impact revenue stability.
- Vulnerability to cyclical nature of the semiconductor industry.
- Geopolitical risks impacting global supply chains.
- High capital expenditure requirements for technology upgrades.
Opportunities
- Growing demand for advanced packaging due to AI, 5G, and automotive trends.
- Expansion into new geographic markets.
- Strategic partnerships and collaborations.
- Development of new, innovative packaging technologies.
- Increased outsourcing of assembly and testing by fabless companies.
Threats
- Intense competition from other OSAT providers.
- Technological obsolescence if innovation pace slows.
- Economic downturns affecting consumer electronics demand.
- Supply chain disruptions (e.g., material shortages, logistics issues).
- Trade tensions and protectionist policies.
Competitors and Market Share
Key Competitors
- ASE Technology Holding Co., Ltd. (ASX)
- Amkor Technology (AMKR)
- JCET Group
- SPIL (Siliconware Precision Industries Co., Ltd.)
- UTAC Holdings Ltd.
Competitive Landscape
ChipMOS excels in wafer-level packaging and bumping, a high-growth segment. While ASE is the market leader overall, ChipMOS maintains a strong competitive position in its specialized areas due to its advanced technology and customer relationships. Its primary disadvantage is its smaller overall market share compared to the largest players.
Growth Trajectory and Initiatives
Historical Growth: Discussion of ChipMOS's growth trends, driven by increasing semiconductor demand and its expansion into advanced packaging technologies. Numerical data on historical revenue and profit growth would be included.
Future Projections: Based on analyst estimates and industry trends, projections for future revenue and earnings growth. (Example: Analysts project an average annual revenue growth of X% over the next 3-5 years.)
Recent Initiatives: Highlighting recent investments in new capacity, research and development into next-generation packaging, and strategic partnerships to drive future growth.
Summary
ChipMOS Technologies Inc. is a strong player in the specialized semiconductor assembly and testing market, particularly in advanced packaging. Its technological expertise and manufacturing capacity are key strengths. However, the company faces intense competition and the cyclical nature of the semiconductor industry. Continued investment in R&D and strategic expansion will be crucial for sustained growth and mitigating risks.
Similar Stocks
Sources and Disclaimers
Data Sources:
- Company Investor Relations Filings (SEC)
- Industry Analyst Reports
- Financial News Outlets
Disclaimers:
This information is compiled for analytical purposes and should not be considered investment advice. Financial data and market share estimates are subject to change and may vary between different sources. It is recommended to conduct independent research before making any investment decisions.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About ChipMOS Technologies Inc
Exchange NASDAQ | Headquaters - | ||
IPO Launch date 2001-06-19 | Chairman, CEO & President Mr. Shih-Jye Cheng | ||
Sector Technology | Industry Semiconductors | Full time employees - | Website https://www.chipmos.com |
Full time employees - | Website https://www.chipmos.com | ||
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
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