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Upturn AI SWOT - About
ChipMOS Technologies Inc (IMOS)
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Upturn Advisory Summary
10/15/2025: IMOS (1-star) has a low Upturn Star Rating. Not recommended to BUY.
Upturn Star Rating
Not Recommended Performance
These Stocks/ETFs, based on Upturn Advisory, consistently fall short of market performance, signaling caution before investing.
Analysis of Past Performance
Type Stock | Historic Profit -6.16% | Avg. Invested days 41 | Today’s Advisory Consider higher Upturn Star rating |
Upturn Star Rating | Upturn Advisory Performance  3.0 | Stock Returns Performance  1.0 |
| Profits based on simulation | Last Close 10/15/2025 |
Key Highlights
Company Size Small-Cap Stock | Market Capitalization 673.53M USD | Price to earnings Ratio 13.92 | 1Y Target Price 20 |
Price to earnings Ratio 13.92 | 1Y Target Price 20 | ||
Volume (30-day avg) - | Beta 0.45 | 52 Weeks Range 12.24 - 25.78 | Updated Date 06/29/2025 |
52 Weeks Range 12.24 - 25.78 | Updated Date 06/29/2025 | ||
Dividends yield (FY) 4.43% | Basic EPS (TTM) 1.33 |
Earnings Date
Report Date - | When - | Estimate - | Actual - |
Profitability
Profit Margin 5.08% | Operating Margin (TTM) 1.72% |
Management Effectiveness
Return on Assets (TTM) 1.44% | Return on Equity (TTM) 4.61% |
Valuation
Trailing PE 13.92 | Forward PE 11.38 | Enterprise Value 669156297 | Price to Sales(TTM) 0.03 |
Enterprise Value 669156297 | Price to Sales(TTM) 0.03 | ||
Enterprise Value to Revenue 0.85 | Enterprise Value to EBITDA 2.85 | Shares Outstanding 35862000 | Shares Floating 575291032 |
Shares Outstanding 35862000 | Shares Floating 575291032 | ||
Percent Insiders - | Percent Institutions 6.3 |
Upturn AI SWOT
ChipMOS Technologies Inc
Company Overview
History and Background
ChipMOS Technologies Inc. was founded in 1997 and is headquartered in Hsinchu, Taiwan. It started as a joint venture and has grown to be a leading provider of outsourced semiconductor assembly and test services (OSAT).
Core Business Areas
- Driver IC Testing and Assembly: Testing and assembly services for display driver ICs, used in LCD panels and other display technologies.
- Memory IC Testing and Assembly: Testing and assembly services for various types of memory ICs, including DRAM, Flash memory, and others.
- Mixed-Signal IC Testing and Assembly: Testing and assembly services for mixed-signal ICs, which combine analog and digital circuitry.
Leadership and Structure
The leadership team consists of experienced executives in the semiconductor industry. The organizational structure includes functional departments for operations, finance, sales, marketing, and engineering.
Top Products and Market Share
Key Offerings
- DRAM Testing and Assembly: Testing and assembly services for DRAM memory. Competitors include ASE, Amkor, and Powertech. ChipMOS holds a significant share in the DRAM testing market, particularly for specialty DRAM. No specific market share percentage available.
- Flash Memory Testing and Assembly: Testing and assembly services for Flash memory. Competitors include ASE, Amkor, and Powertech. No specific market share percentage available.
- Display Driver IC (DDIC) Testing and Assembly: Testing and assembly services for display driver ICs. This is another key area, with competition from companies like Chipbond and others. No specific market share percentage available.
Market Dynamics
Industry Overview
The OSAT industry is experiencing growth driven by increasing semiconductor content in various applications, including consumer electronics, automotive, and industrial applications.
Positioning
ChipMOS is a mid-sized player in the OSAT industry, focusing on providing specialized testing and assembly services, particularly for memory and display driver ICs. Its competitive advantages include its technological expertise and strong relationships with key customers.
Total Addressable Market (TAM)
The global OSAT market is estimated to be hundreds of billions of USD. ChipMOS is well-positioned to capture a share of this market, specifically within the memory and DDIC segments.
Upturn SWOT Analysis
Strengths
- Strong expertise in memory and DDIC testing and assembly
- Established relationships with leading semiconductor manufacturers
- Advanced technology and equipment
- Strategic location in Taiwan
Weaknesses
- Smaller scale compared to larger OSAT players
- Concentration on specific market segments may limit growth
- Susceptibility to fluctuations in the semiconductor industry
Opportunities
- Growing demand for advanced packaging and testing services
- Expansion into new markets and applications
- Strategic alliances and partnerships
- Increasing semiconductor content in automotive and IoT
Threats
- Intense competition in the OSAT industry
- Technological advancements requiring significant capital investment
- Economic downturns impacting semiconductor demand
- Geopolitical risks
Competitors and Market Share
Key Competitors
- ASE (ASX)
- Amkor (AMKR)
- Powertech (PTI)
Competitive Landscape
ChipMOS faces competition from larger OSAT players like ASE and Amkor. ChipMOS focuses on specific niches, such as memory and DDIC, which allows it to compete effectively.
Growth Trajectory and Initiatives
Historical Growth: ChipMOS has experienced moderate growth in recent years, driven by demand for its testing and assembly services. Growth rates has flactuated based on the demand.
Future Projections: Analyst estimates suggest continued growth for ChipMOS, driven by the expansion of the semiconductor industry. Specific financial projections would require analyst reports.
Recent Initiatives: Recent initiatives include investments in new equipment and technologies to support advanced packaging and testing. Focus on advanced testing capabilities.
Summary
ChipMOS Technologies Inc. is a mid-sized player in the OSAT industry with a specialization in memory and DDIC testing and assembly. It benefits from strong expertise and established relationships but faces competition from larger companies. Growth opportunities lie in expanding into new markets and capitalizing on the increasing demand for advanced packaging and testing. ChipMOS needs to focus on technological advancements and managing economic and geopolitical risks to maintain its competitiveness.
Peer Comparison
Sources and Disclaimers
Data Sources:
- Company Website
- Industry Reports
- Analyst Reports (where available, but not directly cited due to paywalls)
Disclaimers:
The data provided is for informational purposes only and should not be considered investment advice. Market share data is estimated based on available information and may not be precise.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About ChipMOS Technologies Inc
Exchange NASDAQ | Headquaters - | ||
IPO Launch date 2001-06-19 | Chairman, CEO & President Mr. Shih-Jye Cheng | ||
Sector Technology | Industry Semiconductors | Full time employees - | Website https://www.chipmos.com |
Full time employees - | Website https://www.chipmos.com | ||
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
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